We have examined the impact of substrates on the performance and response to hot-carrier stress of polycrystalline silicon n-channel thin film transistors. Non-barrier coated Corning Code 1737 glass, fused silica and oxidized Si were used as substrates for transistors made in polycrystalline Si films deposited by low-pressure chemical vapour deposition. It is established that the substrate type strongly influences the transistor's transfer characteristics: transistors on fused silica are found to be superior in performance and hot-carrier reliability to transistors on 1737 glass or oxidized Si substrates. It is argued that the transistor's characteristics are determined by grain geometries and impurities in polycrystalline Si which are functions of the impurity content of the substrate and the properties of its interface with crystalline Si.