A new force sensor with metal measuring grid transverse to the lines of force

Oppermann, K.-G.

doi:10.1016/0250-6874(85)80002-0

Cited by 6 publications

(6 citation statements)

References 1 publication

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“…In a typical load transducer system (compressive type), metallic or silicon spring elements can be used with elasticity or piezo-resistive property of the material (Opperman 1985;Robert et al 2000). While the previous work presents the possibilities of application of these materials or techniques for a load transducer system, we believe that there is a need to address all the design considerations and its integration to complete the whole system.…”

Section: Proposed Layout and Operationmentioning

confidence: 99%

“…Based on measurement technique, these transducers can measure loads from micrograms to tones (Ernest Doebelin 2004). The compressive type load cells are widely used for measuring higher loads, which are typically made of metallic strain gauges as the sensing elements (Opperman 1985). One particular choice have been made earlier (Robert et al 2000;Elwenspoek et al 2000), using silicon as a material for spring element (sensing gauge) of the load cell and the microfabrication technique for its manufacturing.…”

Section: Introductionmentioning

confidence: 99%

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System integration design in MEMS — A case study of micromachined load cell

Kumar

Venkatesh

Baskar

et al. 2009

Sadhana

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One of the critical issues in large scale commercial exploitation of MEMS technology is its system integration. In MEMS, a system design approach requires integration of varied and disparate subsystems with one of a kind interface. The physical scales as well as the magnitude of signals of various subsystems vary widely. Known and proven integration techniques often lead to considerable loss in advantages the tiny MEMS sensors have to offer. Therefore, it becomes imperative to think of the entire system at the outset, at least in terms of the concept design. Such design entails various aspects of the system ranging from selection of material, transduction mechanism, structural configuration, interface electronics, and packaging. One way of handling this problem is the system-in-package approach that uses optimized technology for each function using the concurrent hybrid engineering approach. The main strength of this design approach is the fast time to prototype development. In the present work, we pursue this approach for a MEMS load cell to complete the process of system integration for high capacity load sensing. The system includes; a micromachined sensing gauge, interface electronics and a packaging module representing a system-in-package ready for end characterization. The various subsystems are presented in a modular stacked form using hybrid technologies. The micromachined sensing subsystem works on principles of piezo-resistive sensing and is fabricated using CMOS compatible processes. The structural configuration of the sensing layer is designed to reduce the offset, temperature drift, and residual stress effects of the piezo-resistive sensor. ANSYS simulations are carried out to study the effect of substrate coupling on sensor structure and its sensitivity. The load cell system has built-in electronics for signal conditioning, processing, and communication, taking into consideration the issues associated with resolution of minimum detectable signal. The packaged system represents a compact and low cost solution for high capacity load sensing in the category of compressive type load sensor.

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Section: Proposed Layout and Operationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

System integration design in MEMS — A case study of micromachined load cell

Kumar

Venkatesh

Baskar

et al. 2009

Sadhana

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“…The membrane and boss deflect due to the applied pressure. In [4] a metal force sensor is described in which a zeranin (88 Cu, 7 Mn, 1 Ge) strain gage is place on a hardened steel plate. Aplate on which the maximum force of 500 kN is applied compresses this gage.…”

Section: Introductionmentioning

confidence: 99%

<title>High-force 10-kN piezoresistive silicon force sensor with output independent of force distribution</title>

Zwijze

Wiegerink

Krijnen

et al. 2000

Micromachined Devices and Components VI

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A 10 kN silicon force sensor is realized in which the force is measured by compressing a meander shaped polysilicon strain gage. A second gage which is not loaded, is used for temperature compensation, for compensation of bending and stretching stresses in the chip and for common changes in zero load resistor values. It is shown that the output of the bridge is a linear function of the force and is independent of the force distribution on the chip. By measuring the resistance change along both gages, the force distribution on the chip can be determined so that it can be detected whether the sensor has an oblique load or not. The production process of the chip is simple and robust. A package is designed to apply the load. Hysteresis experiments are performed at four temperatures between 25°C and 47 °C. Hysteresis measurements at room temperature are in close agreement with finite element calculations. The maximum hysteresis error is within 14 % of the full-scale output (fso). Creep was tested by loading it five times. It follows that creep is smaller than 0.01 % of the fso. The total error including interpolation error is within

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“…In order to avoid that the stress distribution determines the output signal of the silicon force sensor, a sensor is needed that is capable of integrating the stress distribution so that the output signal is directly related to the total force ([2], [3]). The sensor described in [2] consists of a resistor made of a zeranin filament (metal) which is deposited on a hardened steel plate with a diameter of 72 mm. It was externally compensated for temperature changes.…”

Section: Introductionmentioning

confidence: 99%

“…Here the surface roughness of both parts and the limited height of the pressing blocks cause a non-homogeneous stress distribution [1]. In order to avoid the stress distribution determining the output signal of the silicon force sensor, a sensor is needed that is capable of integrating the stress distribution so that the output signal is directly related to the total force [2,3].…”

Section: Introductionmentioning

confidence: 99%

Low-cost piezoresistive silicon load cell independent of force distribution

Zwijze¹,

Wiegerink²,

Krijnen³

et al. 2000

J. Micromech. Microeng.

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A silicon load cell (force sensor) is presented which is based on a new operating principle. The force is measured by compressing a meander like strain gage. A second strain gage which is not loaded, is used for temperature compensation and for compensation of bending and stretching stresses in the chip. Also, same changes in zero load resistor values are eliminated. It is shown that the output of the bridge is a linear function of the total force and independent of the force distribution on the silicon chip. Measurements up to 1000 kg show a linear respons and a short term repeatability which is within 0.1 %. Creep after 30 minutes is within 1.2 %.

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A new force sensor with metal measuring grid transverse to the lines of force

Cited by 6 publications

References 1 publication

System integration design in MEMS — A case study of micromachined load cell

System integration design in MEMS — A case study of micromachined load cell

<title>High-force 10-kN piezoresistive silicon force sensor with output independent of force distribution</title>

Low-cost piezoresistive silicon load cell independent of force distribution

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