A new paradigm for high resolution 3D lithography

Mosher, L. A.; Waits, C.M.; Morgan, Brian; Ghodssi, Reza

doi:10.1109/memsys.2008.4443676

Cited by 2 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…To explore the cause of this roughness, the effect of misalignment between the two exposures was investigated (Figure 4.9). If the second exposure is misaligned from the first exposure, erroneous pixel combinations will be exposed at the gray level boundaries [46]. These erroneous pixel combinations are outlined by gray dashed lines.…”

Section: Mask Misalignmentmentioning

confidence: 99%

Double-Exposure Grayscale Photolithography

Mosher

Waits

Morgan

et al. 2009

J. Microelectromech. Syst.

Self Cite

View full text Add to dashboard Cite

Three-dimensional (3D) photoresist structures may be realized by controlling the transmitted UV light intensity in a process termed gray-scale photolithography.Light modulation is accomplished by diffraction through sub-resolution pixels on a photomask. The number of photoresist levels is determined by the number of different pixel sizes on the mask, which is restricted by mask fabrication. This drawback prevents the use of gray-scale photolithography for applications that need a high vertical resolution.The double-exposure gray-scale photolithography technique was developed to improve the vertical resolution without increasing the number of pixel sizes. This is achieved by using two gray-scale exposures prior to development. The resulting overlay produces an exposure dose that is a combination of both exposures.Calibration is utilized to relate the pixel sizes and exposure times to the photoresist height. This calibration enables automated mask design for arbitrary 3D structures and investigation of other effects, such as misalignment between the exposures.

show abstract

Section: Mask Misalignmentmentioning

confidence: 99%