A new patterning process concept for large-area transistor circuit fabrication without using an optical mask aligner

Mikami, Yoshiro; Nagae, Yoshiharu; Mori, Yuichi; Kuwabara, Kei; Saito, Tatsuro; Hayama, Hiroshi; Asada, Hiroaki; Akimoto, Yusuke; Kobayashi, Masato; Okazaki, Shoji; Asaka, Kinji; Matsui, H.; Nakamura, Kazumitsu; Kaneko, Eiji

doi:10.1109/16.275214

Cited by 52 publications

(25 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Kumar and Whitesides 7 printed alkylthiol patterns onto gold surfaces via microcontact printing. Mikami et al 8 and Leppävuori et al 9 used a hybrid gravure-offset technique to print photolithographic masks for TFT processing. Gleskova et al have employed laser-printed toner patterns as an etch mask in the fabrication of TFTs.…”

Section: Introductionmentioning

confidence: 99%

Physical mechanisms governing pattern fidelity in microscale offset printing

Darhuber

Troian

Wagner

2001

Journal of Applied Physics

View full text Add to dashboard Cite

We have studied the offset printing of liquid polymers curable by exposure to ultraviolet light onto flat and unpatterned silicon and glass substrates. The interplay of capillary, viscous, and adhesion forces dominates the dynamics of ink transfer at small feature sizes and low capillary number. For smooth and nonporous substrates, pattern fidelity can be compromised because the ink contact lines are free to migrate across the substrate during plate separation. Using a combination of experiments and equilibrium simulations, we have identified the physical mechanisms controlling ink transfer and pattern fidelity. In considering the resolution limit of this technique, it appears that the dynamics of ink flow and redistribution during transfer do not explicitly depend on the absolute feature size, but only on the aspect ratio of film thickness to feature size. Direct printing holds promise as a high-throughput fabrication method for large area electronics.

show abstract

Section: Introductionmentioning

confidence: 99%

Physical mechanisms governing pattern fidelity in microscale offset printing

Darhuber

Troian

Wagner

2001

Journal of Applied Physics

View full text Add to dashboard Cite

show abstract

“…In recent years, innovative stamping and printing techniques [1][2][3][4][5][6][7][8] have been developed as alternatives to patterning metallic films by photolithography. In a recent study, we reported the use of a commercial ink jet printer to form pure copper lines with a resistivity of 10 ⍀ cm.…”

mentioning

confidence: 99%

Using Convective Flow Splitting for the Direct Printing of Fine Copper Lines

et al. 2000

View full text Add to dashboard Cite

Liquid ribbons of solutions of copper hexanoate in a volatile solvent were drawn on a glass slide using either fine glass capillaries or an ink jet printer. After solvent evaporation, the solute was observed to segregate into multiple pairs of stripes much narrower than the initial ribbon diameter. These stripes were then converted to pure copper by annealing. Surface profiles indicate that the thickness, width, and number of lines formed are strongly dependent on the solution viscosity and volume per unit length deposited. From flow visualization studies and surface profiling, we have found that evaporative cooling produces Bénard-Marangoni convection patterns which accrete the solute along two key boundaries of the flow, namely the three phase contact line and the outer edge of a stagnant region about the ribbon apex. These findings suggest that optimization of the deposition and evaporation process can be used to ''write'' fine metallic lines from a wider liquid precursor.

show abstract

“…Tiberio et al 3 have also used alkane thiol monolayers patterned by electron-beam lithography, as etch masks for gallium arsenide. Mikami et al 4 introduced a gravureoffset technique to print ink that serves as a photo-mask on a photoresist film used for fabrication of thin-film transistors ͑TFTs͒. Lahti et al 5 have employed a similar technique to directly print conductive thick-film inks.…”

Section: Introductionmentioning

confidence: 99%

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique

Miller

Troian

Wagner

2002

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

View full text Add to dashboard Cite

We have developed a letterpress technique capable of printing polymer films with micrometer scale feature sizes onto flat or spherically shaped nonporous substrates. This printing technique deposits polymer only in desired regions thereby eliminating subsequent developing and subtraction steps. Flat or curved printing plates, which are fabricated from either rigid or deformable materials, are used to transfer thin molten polymer films onto flat target substrates. By deforming the printing plates into a spherical shape, it is also possible to print patterned films onto the concave side of a spherically deformed target substrate. These printed films serve as good resists for both wet chemical etching and reactive ion etching. Interferometric measurements of the polymer film thickness are used to probe physical mechanisms affecting printing instabilities, pattern fidelity, and edge resolution. Our experimental study indicates that this letterpress technique may prove suitable for high-throughput device fabrication involving large-area microelectronics.

show abstract

A new patterning process concept for large-area transistor circuit fabrication without using an optical mask aligner

Cited by 52 publications

References 5 publications

Physical mechanisms governing pattern fidelity in microscale offset printing

Physical mechanisms governing pattern fidelity in microscale offset printing

Using Convective Flow Splitting for the Direct Printing of Fine Copper Lines

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique

Contact Info

Product

Resources

About