2001
DOI: 10.1016/s0925-4005(00)00643-2
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A new PMMA-microchip device for isotachophoresis with integrated conductivity detector

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Cited by 171 publications
(64 citation statements)
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“…[1][2][3][4][5][6][7] Conductivity detection can be classified into two modes: contact mode and contactless mode. In contact mode, the microelectrode directly contacts the solution.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…[1][2][3][4][5][6][7] Conductivity detection can be classified into two modes: contact mode and contactless mode. In contact mode, the microelectrode directly contacts the solution.…”
Section: Introductionmentioning
confidence: 99%
“…In contact mode, the microelectrode directly contacts the solution. 1,2 In contactless mode, the microelectrode is insulated from the solution by an insulating layer. [3][4][5][6][7] Compared with contact mode, contactless mode has several advantages because of the insulation of the electrode from the solution, such as the elimination of electrode fouling, bubble generation, and the isolation from the separation voltage.…”
Section: Introductionmentioning
confidence: 99%
“…Conducting metal films, as EC electrodes, were formed by sputtering, vapor deposition or chemical plating. Many types of EC electrodes have been successfully integrated on glass or polymer chips [13][14][15]. However, EC detection is prone to suffer from the high separation electric field, and the interference gives rise to a larger background current and a shifted redox potential.…”
Section: Introductionmentioning
confidence: 99%
“…Polymer bonding technologies have also been required for sealing or stacking the devices. Some examples of bonding methods have been reported, including thermal direct bonding (Spierings & Haisma, 1994;Chen et al, 2004;Shinohara et al, 2007b), solvent bonding (Wang et al, 2002;Lin et al, 2007), and bonding using other intermediate layer (Graß et al, 2001;Lei et al, 2004). Low-temperature bonding technologies are required with deformation of the previous surface structures as small as possible.…”
Section: Introductionmentioning
confidence: 99%