“…Polymer bonding technologies have also been required for sealing or stacking the devices. Some examples of bonding methods have been reported, including thermal direct bonding (Spierings & Haisma, 1994;Chen et al, 2004;Shinohara et al, 2007b), solvent bonding (Wang et al, 2002;Lin et al, 2007), and bonding using other intermediate layer (Graß et al, 2001;Lei et al, 2004). Low-temperature bonding technologies are required with deformation of the previous surface structures as small as possible.…”