2004
DOI: 10.1109/tnano.2003.820774
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A New Route to Zero-Barrier Metal Source/Drain MOSFETs

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Cited by 122 publications
(88 citation statements)
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“…Over the years, various attempts have been made to lower the SBH at silicon-silicide interfaces to improve the performance of SB-MOSFETs by, for example, dopant segregation, 4 inserting an ultrathin insulator at the interface, 5,6 introducing organic molecules 7 or defects at the interface, 8 and tuning the metal work function using a capping layer or dopant-induced strain. [9][10][11][12] The introduction of appropriate dopants at the silicide-silicon interface, e.g., B for PtSi and As for ErSi, known as dopant segregation, 4 has been successfully implemented.…”
Section: Introductionmentioning
confidence: 99%
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“…Over the years, various attempts have been made to lower the SBH at silicon-silicide interfaces to improve the performance of SB-MOSFETs by, for example, dopant segregation, 4 inserting an ultrathin insulator at the interface, 5,6 introducing organic molecules 7 or defects at the interface, 8 and tuning the metal work function using a capping layer or dopant-induced strain. [9][10][11][12] The introduction of appropriate dopants at the silicide-silicon interface, e.g., B for PtSi and As for ErSi, known as dopant segregation, 4 has been successfully implemented.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, it is difficult to implement in sub-20 nm devices. An inserted ultrathin insulator was able to lower the SBH because it depended on the Fermi level, 5,6 but sufficiently low SBH has never been achieved so far. We suggest that SBH can be lowered by uniaxial strain applied at both the channel and the source/drain and that therefore, the strain engineering is applicable for higher-performing SB-MOSFETs.…”
Section: Introductionmentioning
confidence: 99%
“…Silicide source/drain (S/D) Schottky barrier field-effect transistors (SBFETs) are promising candidates for sub-32nm CMOS technology [1][2][3][4], as the silicide S/D can provide abrupt junctions together with lower serial resistance as compared to conventional doped S/D junctions. One of the key challenges in SBFETs is to obtain a low Schottky barrier height (SBH) at the silicide-channel junction [2]- [3].…”
Section: Introductionmentioning
confidence: 99%
“…One of the key challenges in SBFETs is to obtain a low Schottky barrier height (SBH) at the silicide-channel junction [2]- [3]. PtSi/YbSi 1+x were considered to be among the best silicide materials for p-/ n-SBFETs application, due to their relative low hole/ electron SBH [4].…”
Section: Introductionmentioning
confidence: 99%
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