A new TiW seed layer for SmCo5 films with perpendicular magnetic anisotropy

Cheng, Weiming; Liu, Wenwu; Xiao, Wang; Dai, Yifan; Cheng, Xingwang; Miao, Xiangshui

doi:10.1016/j.jmmm.2012.05.015

Cited by 3 publications

(1 citation statement)

References 15 publications

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“…Sayama, Zhang, and Zhao have investigated the effects of substrate temperature, seed layers, and capping layer on the magnetic properties of SmCo 5 films [1][2][3][4]; however, the systemic study of the dependence of magnetic properties on the sputtering parameters such as sputtering power, thickness, and annealing temperature has not been carried out yet. Our pervious article showed the TiW seed layer can prevent Cu from diffusing into glass substrate and SmCo 5 films might benefit from the microstructure of Cu layer [7].…”

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confidence: 95%

Effect of Sputtering Parameters on the Magnetic Properties of SmCo₅/Cu Films

Cheng

Dai

et al. 2013

Materials and Manufacturing Processes

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SmCo 5 film is an emerging candidate for the recording material of future high density magnetic recording because of its huge uniaxial magneto-crystalline anisotropy. In this article, SmCo 5 films were fabricated by radio frequency (RF) magnetron sputtering system onto quartz glass substrate, and a Cu underlayer was proposed in order to improve magnetic properties of SmCo 5 films. The dependences of sputtering power, thickness and annealing temperature on the magnetic properties of SmCo 5 /Cu films were studied. Using the optimal sputtering parameters of sputtering power of 60 w, thickness of 65 nm, and annealing temperature of 650 C, the coercivity of SmCo 5 /Cu films is improved significantly.

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