A New Transistor with Two‐Level Metal Electrodes

Abstract

A new transistor with two‐level metal electrodes is developed in order to allow for the automatic wire bonding process and at the same time to minimize the chip area. To meet these requirements, the second‐level electrodes are formed right above the active area of a conventional transistor by utilizing the PMP (planar metallization with polymer) technology (1) with PIQ (polyimide iso‐indroquinazolinedione) film as an insulating layer. PIQ is a thermally stable polyimide‐type resin specially synthesized by us for the semiconductor devices. Through several types of reliability tests, it is shown that the new transistor exhibits excellent reliability in its device characteristics, indicating that the new structure satisfies the stringent reliability and productivity requirements for transistors molded in plastics.

Characterization and processing of polyimide thin films for microelectronics application

“…PIQ-13 and PIQ-Coupler-3 (Saiki et al, 1977) were obtained from Hitachi Chemical Co., Ltd., Japan. PI-2555 * To whom correspondence should be addressed.…”

Effect of Cross-linker on Photosensitive Polyimide to Achieve Full Imidization and Lower Stress for Good Reliability

“…Due to the excellent thermal, mechanical and electrical properties as well as good chemical resistance, polyimide (PI) and poly(benzoxazole) (PBO) have been widely used as stress buffer coatings and redistribution layers (RDL) for packages that have copper re-routing distribution layers to improve the reliability of semiconductor devices [1,2].…”

Spontaneous Chain Orientation of Aromatic Polyimides Evolved during Thermal Imidization from Shear-Oriented Glassy Liquid Crystalline Precursors

“…Aromatic polyimides (PIs) are widely used as insulating layers and coating films in many electronic devices and thin-film substrates, for example, thermal blankets and solar sails on artificial satellites − and flexible printed circuit boards. , This is partly due to their high chemical and thermal stabilities and mechanical strength among the organic polymers, as well as their excellent electric and thermal insulating properties and relatively low coefficient of thermal expansion. − These PI film materials are generally fabricated through coating processes from a precursor solution of poly­(amic acid), PAA, because PAA solution possesses good processability for coating, whereas most PIs neither dissolve in solvents nor melt by heat. During the thermal curing process, the coated PAA film is converted into the corresponding PI film.…”