A new value for Johnson Cook damage limit criterion in machining with large negative rake angle as basis for understanding of grinding

Abstract

Grinding is one of the most complex manufacturing processes in industry and understanding its physics is still fairly limited due to the stochastic nature of the process. The physics behind the grinding process can be better understood through thermomechanical analysis of grain-material interactions, enabling the optimization of the process and grinding tool. When simulating the chip formation in machining processes, difficulties arise when the negative rake angle is large, when thermal effects on the tool and workpiece become prominent and when there is the necessity to consider damage within the constitutive equations of the workpiece material. These difficulties become further intensified given small depths of cut as in the case of grinding and the need for three-dimensional models. A coupled thermomechanical dynamic analysis is performed to simulate linear machining experiments effectuated by single diamond grains. Damage is described within a Johnson-Cook model. The damage parameters when machining Ti-6Al-4V are optimized in a three dimensional model and a new concept of applying a damage limit when machining with negative rake angle is suggested. Here, a Fortran subroutine is written to calculate the damage field variable. The simulated cutting forces and temperature in the tool as well as the workpiece are validated. Validation experiments are carried out by single grain machining experiments at a depth of cut of 30 m and at a linear cutting velocity of 0.8 m/s. Numerical challenges, such as chip separation criterion and settings of adaptive remeshing are addressed. Finally, it is shown that with an increase in the cutting edge radius, cutting forces and especially passive forces increase.

Optimization of the cutting tool geometry when milling aluminum honeycomb structures

“…With d1, d2, d3 and d4, parameters of Johnson Cook's law at fracture associated with the machined material, σ m is the hydrostatic pressure, and is the equivalent von Mises stress [21][22][23][24][25]. Damage…”

Ultrafine ductile-mode dicing technology for SiC substrate with metal film using PCD blade

“…Given this, once the cutting edge becomes even slightly worn, the cutting chips become lodged on and adhere to the flank face. Thus, the insufficient flank clearance leads to the large negative rake angle at the local point of view of the tip of the cutting edge (Akbari , et al 2016). The insufficient flank clearance at the foot of the cutting edges renders the cutting process inefficient.…”

Study on chip removal mechanism of PCD ball-end milling (1st report) cutting simulation by orthogonal cutting

“…To investigate the chip removal mechanism of the PCD ball end mill, an orthogonal cutting with a single-point PCD tool is studied. The concept is a helps-better understand of the chip formation mechanism and other phenomena in varieties of both traditional cutting and the action of abrasive grits (Akbari et al, 2016;Baizeau et al, 2015;Ding et al, 2020). Previous studies reported that chip can be generated on ductile materials by using cutting tool having a large negative rake down to −75° (Fang, 2005, Komanduri, 1971.…”