2015 IEEE International Electron Devices Meeting (IEDM) 2015
DOI: 10.1109/iedm.2015.7409663
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A next generation CMOS-compatible GaN-on-Si transistors for high efficiency energy systems

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Cited by 50 publications
(19 citation statements)
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“…Results in [94] and [95] promise a high reliability of GaN devices under hard environmental conditions. Commercially available 650 V devices are qualified according to the JEDEC Solid State Technology Association (JEDEC) tests including 1000 hours of high temperature reverse bias [96].…”
Section: B Reliability and Safetymentioning
confidence: 99%
“…Results in [94] and [95] promise a high reliability of GaN devices under hard environmental conditions. Commercially available 650 V devices are qualified according to the JEDEC Solid State Technology Association (JEDEC) tests including 1000 hours of high temperature reverse bias [96].…”
Section: B Reliability and Safetymentioning
confidence: 99%
“…Several advanced types of AlGaN/GaN FET devices have been explored recently. Among of them, the GaN MOS or MIS (metal-insulator-semiconductor) HEMTs has drawn most of the attention [9,14,28,43], so do the MISHEMTs with high-K gate dielectric [17,31,44]. Other new devices with a regrowth of AlGaN layer [41], or a regrowth of GaN drift channel layer [45] have also been reported.…”
Section: Algan/gan Hemt Devicementioning
confidence: 99%
“…GaN-based HEMTs on silicon substrate are particularly appealing to the IC industry due to its compatibility with the industry-matured Si-CMOS IC technologies. Tremendous research and development work has been conducted and reported in the recent years with significant progresses on GaN-on-Si HEMTs covering the full scope of a new IC-chain, including the industrial acceptable-low defect quality of GaN-on-Si epitaxial materials, the optimized GaN-based HEMT devices and integration [11][12][13][14][15][16][17], the significantly enhanced reliability [18][19][20][21][22][23][24], the comprehensive circuit and device modeling [25][26][27] and the product designs [19,[28][29][30][31][32][33][34].…”
Section: Introductionmentioning
confidence: 99%
“…Then, the evolution of the Au-free process flow for CMOS-compatible GaN technology will be illustrated. We will also discuss the new developments in structures and materials used in CMOS-compatible manufacturing processes in ohmic contact formation and gate structures [ 44 , 45 ].…”
Section: Introductionmentioning
confidence: 99%