A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

Xiong, Chuanguo; Zeng, Baoshan; Huang, Yuhua; Zhu, Fan

doi:10.1109/eptc56328.2022.10013236

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022

DOI: 10.1109/eptc56328.2022.10013236

|View full text |Cite

A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

Chuanguo Xiong

Baoshan Zeng

Yuhua Huang

et al.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2023

Publication Types

Select...

Article2

Relationship

Self Cite0

Independent2

Authors

Journals

Cited by 2 publications

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

A full-field warpage characterization measurement method coupled with infrared information

Zeng,

Gao,

Xiong

et al. 2023

Microelectronics Reliability

View full text Add to dashboard Cite

A full-field warpage characterization measurement method coupled with infrared information

Zeng,

Gao,

Xiong

et al. 2023

Microelectronics Reliability

View full text Add to dashboard Cite

Rapid and high-precision displacement sensing based on the multiple mode dip areas in a SNAP microresonator

Dong,

Li,

Wang

et al. 2023

Appl. Opt.

View full text Add to dashboard Cite

Whispering gallery mode (WGM) microresonators offer significant potential for precise displacement measurement owing to their compact size, ultrahigh sensitivity, and rapid response. However, conventional WGM displacement sensors are prone to noise interference, resulting in accuracy loss, while the demodulation process for displacement often exhibits prolonged duration. To address these limitations, this study proposes a rapid and high-precision displacement sensing method based on the dip areas of multiple resonant modes in a surface nanoscale axial photonics microresonator. By employing a neural network to fit the nonlinear relationship between displacement and the areas of multiple resonant dips, we achieve displacement prediction with an accuracy better than 0.03 µm over a range of 200 µm. In comparison to alternative sensing approaches, this method exhibits resilience to temperature variations, and its sensing performance remains comparable to that in a noise-free environment as long as the signal-to-noise ratio is greater than 25 dB. Furthermore, the extraction of the dip area enables significantly enhanced speed in displacement measurement, providing an effective solution for achieving rapid and highly accurate displacement sensing.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

A non-destructive inspection method for electronic packaging reliability incorporating mechanical and thermal information

Cited by 2 publications

References 13 publications

A full-field warpage characterization measurement method coupled with infrared information

A full-field warpage characterization measurement method coupled with infrared information

Rapid and high-precision displacement sensing based on the multiple mode dip areas in a SNAP microresonator

Contact Info

Product

Resources

About