1987 International Electron Devices Meeting 1987
DOI: 10.1109/iedm.1987.191567
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A non-volatile memory cell based on ferroelectric storage capacitors

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Cited by 15 publications
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“…Further, the deposition technique of ferroelectric thin films has been demonstrated to be compatible with CMOS (Complementary Metal Oxide Semiconductor) integrated circuit processes [13]. cell [14]. The operation of this example is based on the hysteresis characteristic illustrated in Fig.…”
Section: Dennition Of Ferroelectricity and The Hysteresis Characterismentioning
confidence: 99%
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“…Further, the deposition technique of ferroelectric thin films has been demonstrated to be compatible with CMOS (Complementary Metal Oxide Semiconductor) integrated circuit processes [13]. cell [14]. The operation of this example is based on the hysteresis characteristic illustrated in Fig.…”
Section: Dennition Of Ferroelectricity and The Hysteresis Characterismentioning
confidence: 99%
“…By using the extracted a(£) in Eqs. (14) and (15), the measured CV characteristic can then be reproduced.…”
Section: E = Dp = A\t-tc)p + L3p^ + Yp' +•mentioning
confidence: 99%
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“…An access device (typically FET) is also needed to prevent cross-talk during programming and reading, configured either as a series element with the capacitor (1T-1C cell) [55,89] (Figure 1.5 B) or as a string of FETs and capacitors connected in parallel, with the BL , which can be used to encode binary data. An access device (typically FET) is also needed to prevent cross-talk during programming and reading, configured either as a series element with the capacitor (1T-1C cell) [55,89] (Figure 1.5 B) or as a string of FETs and capacitors connected in parallel, with the BL , which can be used to encode binary data.…”
Section: Ferro-electric Rammentioning
confidence: 99%
“…Finally, nano-second speed of domain switching implies that they are applicable to a high-speed memory device. Since ferroelectric capacitors was explored for use in memory applications by Kinney et al (Kinney et al, 1987); Evans and Womack (Evans & Womack, 1988); and Eaton et al (Eaton et al, 1988), it has been attempted to epitomize ferroelectrics to applicable memory solutions in many aspects. In the beginning of 1990's, silicon institutes have begun to exploit ferroelectrics as an application for high-density DRAMs (Moazzami et al, 1992;Ohno et al, 1994).…”
Section: Introductionmentioning
confidence: 99%