In this article, an optimized silicon carbide (SiC) trench Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) structure with side-wall p-type pillar (p-pillar) and wrap n-type pillar (n-pillar) in the n-drain was investigated utilizing Silvaco TCAD simulations. The optimized structure main includes a p+ buried region, a light n-type current spreading layer (CSL), a p-type pillar region, and a wrapping n-type pillar region at the right and bottom of the p-pillar. The improved structure is named SNPPT-MOS. The side-wall p-pillar region could better relieve the high electric field around the p+ shielding region and the gate oxide in the off-state mode. The wrapping n-pillar region and CSL can also effectively reduce the specific on-resistance (R
on,sp). As a result, the SNPPT-MOS structure exhibits that a higher figure of merit (FoM) related to the breakdown voltage (V
BR) and the R
on,sp (V
BR
2/R
on,sp) of the SNPPT-MOS is improved by 44.5%, respectively, with comparison to that of the conventional trench gate SJ MOSFET (full-SJ-MOS). In addition, the SNPPT-MOS structure achieves a much faster-switching speed than the full-SJ-MOS, and the result indicated an appreciable reduction in the switching energy loss.