2019
DOI: 10.1088/1361-6528/ab030c
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A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO3 nanomaterial

Abstract: Nano-soldering relying on a sacrificial nanosolder, is a flexible interconnection technique, having promising applications in joining nanosized functional materials; that is an essential step in the assembly of nano-devices. In a soldering, the wettability is important in the bonding of two nanomaterial, which determines the quality of the junction. Tungsten trioxide nanomaterial has unique characteristics such as electro-, opto-, gaso-chromic. To assemble this nanomaterial into functional nano-devices, a supe… Show more

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Cited by 6 publications
(10 citation statements)
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“…Many interconnection techniques have emerged [3,[8][9][10][11][12][13][14], among which the nanosoldering has shown great promise as it can use a nanosolder as filler material to accomplish an interconnection without detrimental effects on the original nano-objects [8,15]. Some kinds of nanoscale solders have been developed to meet the demand for nanosoldering applications, such as Sn, SnCu, SnAu, SnIn, SnCuAg, SnCuMn nanosolders [15][16][17][18][19][20], etc. In this technique, nanosolders melt through reflow process and then wet nanomaterials to be joined to form electrical contacts, thereby accomplishing the assembly of functional nanodevices [8,15,17].…”
Section: Introductionmentioning
confidence: 99%
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“…Many interconnection techniques have emerged [3,[8][9][10][11][12][13][14], among which the nanosoldering has shown great promise as it can use a nanosolder as filler material to accomplish an interconnection without detrimental effects on the original nano-objects [8,15]. Some kinds of nanoscale solders have been developed to meet the demand for nanosoldering applications, such as Sn, SnCu, SnAu, SnIn, SnCuAg, SnCuMn nanosolders [15][16][17][18][19][20], etc. In this technique, nanosolders melt through reflow process and then wet nanomaterials to be joined to form electrical contacts, thereby accomplishing the assembly of functional nanodevices [8,15,17].…”
Section: Introductionmentioning
confidence: 99%
“…By mimicking bulk solder, the reflow furnace has been first used to study the nanosolder's wettability. Peng et al and Gao et al reflowed Sn and Sn-based nanosolders on substrates by furnace heating with the usage of flux, respectively, showing that the nanosolders underwent a complete morphological transition from nanowires to spheres, and contact angles of the reflowed nanosolders on substrates were obtained [20,27]. Recently, electron beam irradiation (EBI) in transmission electron microscopy (TEM), Joule heating from electrical currents and laser irradiation in scanning electron microscopy (SEM) have been developed to reflow nanosolder [8,9,20].…”
Section: Introductionmentioning
confidence: 99%
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“…Among various materials as nanozymes, Mn is a multivalent transition metal and is commonly found in the following valence states Mn (II), Mn (III), Mn (IV), Mn (V), Mn (VI), and Mn (VII). Mn-based nanomaterials feature easy preparation, low cost, environment friendly, and excellent physicochemical properties, enabling them to be widely used in materials, [23] electronics, [24] environmental protection, [25] and biomedical fields. [26] At the same time, as Mn is one of the essential elements in the human body, it is a biocompatible element that plays a physiological role, [21] which allows Mn-based materials for significant applications in the biomedical field.…”
Section: Introductionmentioning
confidence: 99%