A novel approach for the thermal characterization of electronic parts

Lasance, C.J.M.; Vinke, H.; Rosten, H.I.; Weiner, K.-L.

doi:10.1109/stherm.1995.512044

Cited by 85 publications

(22 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…CTMs have been successfully employed in the analysis and development of electronic components where the conductivity of the materials was unknown. The DELPHI team [5,6] developed a formal procedure to generate CTMs which were Boundary Condition Independent. In this way the CTMs were reproducing the object behaviour under "any" boundary condition applied and could be used as a black box.…”

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

Development and validation of a compact thermal model for an aircraft compartment

Geron

Butler

Stafford³

et al. 2013

Applied Thermal Engineering

View full text Add to dashboard Cite

Highlights• Development of a reduced order model for the case of an aircraft crown compartment • A thermal fluid network is generated for its mixed convection regime • Regression analysis utilised to evaluate characteristic parameters • The thermal fluid network is simple but its accuracy is close to the detailed model *Highlights (for review) M A N U S C R I P T A C C E P T E D AbstractThe development of accurate structural/thermal numerical models of complex systems, such as aircraft fuselage barrels, is often limited and determined by the smallest scales that need to be modelled. The development of reduced order models of the smallest scales and consequently their integration with higher level models can be a way to minimise the bottle neck present, while still having efficient, robust and accurate numerical models. In this paper a methodology to the applied boundary condition set. CTFMs thus generated can be then integrated in complex numerical modelling of whole fuselage sections.Further steps in the development of an exhaustive methodology would be the implementation of a logic ruled based approach to extract directly from the CFD simulations numbers and positions of the nodes for the CTFM.

show abstract

Section: A C C E P T E D Accepted Manuscriptmentioning

confidence: 99%

Development and validation of a compact thermal model for an aircraft compartment

Geron

Butler

Stafford³

et al. 2013

Applied Thermal Engineering

View full text Add to dashboard Cite

show abstract

“…There have been abundant existing compact thermal modeling methods in the literature. For example, the authors of [4] [5] [9] propose the DELPHI approach and introduce the important concept of boundary condition independence (BCI). The DELPHI approach extracts and optimizes a thermal resistance network from detailed model simulations under a set of standard boundary conditions.…”

Section: ) Computational Speedmentioning

confidence: 99%

Parameterized physical compact thermal modeling

Huang

Stan

Skadron

2005

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

Abstract-This paper presents a compact thermal modeling approach, which is fully parameterized according to design geometries and material physical properties. While most compact modeling approaches facilitate thermal characterization of existing package designs, our method is better suited for preliminary exploration of the design space at both the silicon level and the package level. We show that our modeling method achieves reasonable boundary condition independence (BCI) by comparing an example compact thermal model with a BCI model for a benchmark BGA single-chip package under the same standard set of boundary conditions. In essence, the presented compact thermal modeling method can act as a convenient medium for enhanced interactions and collaborations among designers at the package, circuit and computer architecture levels, leading to efficient early evaluations of different thermally-related design trade-offs at all the above levels of abstraction before the actual detailed design is available. The presented modeling method can be easily extended to model emerging packaging schemes such as stacked chip-scale packaging (SCP) and 3-D integration.Index Terms-compact thermal model, boundary condition independence (BCI), package design, parametrization, temperature.

show abstract

“…Surface-to-surface resistors were added to the improved star-shaped network for representing the realistic characterisation of heat transfer in a better manner. In all of the 38 kinds of different conditions mentioned in [9], the improved model can predict the junction temperature accurately; the error is only 1 -2%.…”

Section: Introductionmentioning

confidence: 98%

“…The network topology is star-shaped and only under isothermal condition can it predict the junction temperature accurately. Rosten et al [7] and Lasance et al [8,9] established an improved star-shaped compact thermal resistance network model that was boundary condition independent. Surface-to-surface resistors were added to the improved star-shaped network for representing the realistic characterisation of heat transfer in a better manner.…”

Section: Introductionmentioning

confidence: 99%

Engineering method for predicting junction temperatures of high-power light-emitting diodes

et al. 2012

View full text Add to dashboard Cite

In order to evaluate the reliability of a high-power light-emitting diode (LED) module, it is important to obtain junction temperature of high-power LED modules in various applications. However, until recently, there were no simple and effective methods to obtain the junction temperature of LEDs. In this study, an engineering method to estimate the junction temperature of typical LED packaging modules by using an analytical solution was proposed. Simple experiments were used to help determine boundary conditions for thermal modelling. Simulations for obtaining thermal resistance and junction temperature of LED packaging modules in the same boundary conditions were also carried out by commercial software COMSOL. On comparing the junction temperatures obtained by the two methods, it can be seen that the proposed model is able to estimate junction temperatures well.

show abstract

A novel approach for the thermal characterization of electronic parts

Cited by 85 publications

References 7 publications

Development and validation of a compact thermal model for an aircraft compartment

Development and validation of a compact thermal model for an aircraft compartment

Parameterized physical compact thermal modeling

Engineering method for predicting junction temperatures of high-power light-emitting diodes

Contact Info

Product

Resources

About