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The accurate prediction of the operating temperatures of critical electronic parts at the component-, board-and systemlevel is seriously hampered by the lack of reliable, standardised input data. This paper is the final report on the 3-year European collaborative project, named DELPHI, whose goal is to solve the aforementioned problem. The project concerns the creation and experimental validation of thermal models (detailed and compact) of a range of electronic parts including mono-chip packages, heat sinks, electrolytic capacitors, transformers and interfacing materials. The purpose of this paper is to give an account of the principal project results. Fuller details of the topics covered can be found in the papers listed in the DELPHI bibliography that is provided at the end of this paper.