Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment

Rosten, H.I.; Parry, John; Lasance, C.J.M.; Vinke, H.; Temmerman, W. M.; Nelemans, W.; Assouad, Y.; Gautier, T.; Slattery, Orla; Cahill, C.; O'Flattery, M.; Lacaze, C.; Zemlianoy, P.

doi:10.1109/stherm.1997.566785

Cited by 28 publications

(19 citation statements)

References 19 publications

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“…Another alternative is the DELPHI methodology for the characterisation o f electronic parts, popularised by the European-funded DELPHI project [46,167] [197].…”

Section: Characterisation Of Electronic Component Thermal Performancementioning

confidence: 99%

“…For component CTM derivation, the procedure presented by Aranyosi et al [49] was adopted, which is a variant o f the DELPHI approach [46,167].…”

Section: Component Modellingmentioning

confidence: 99%

“…The cost function used in minimising global errors is given in [50]. [46,167] in the selection o f the boundary conditions employed for CTM derivation. Whereas Aranyosi et al [49] use a Design o f Experiments approach, the DELPHI procedure uses a more extensive set o f up to 99 boundary conditions [50], spanning the complete range o f heat transfer coefficients encountered in electronics cooling applications.…”

Section: Both Flotherm Andmentioning

confidence: 99%

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An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

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The flow modeling approaches employed in Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced airflows over populated Printed Circuit Boards. This limitation has been previously highlighted [1], with component junction temperature prediction errors of up to 35% reported. This study evaluates the predictive capability of candidate turbulence models more suited to the analysis of electronic component heat transfer. Significant improvements in component junction temperature prediction accuracy are obtained, relative to a standard high-Reynolds number k-e model, which are attributed to better prediction of both board leading edge heat transfer and component thermal interaction. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence in the thermal design process, and the generation of more accurate temperature boundary conditions for use in Physics-of-Failure based reliability prediction methods. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to board-level analysis.

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“…Another alternative is the DELPHI methodology for the characterisation o f electronic parts, popularised by the European-funded DELPHI project [46,167] [197].…”

Section: Characterisation Of Electronic Component Thermal Performancementioning

confidence: 99%

“…For component CTM derivation, the procedure presented by Aranyosi et al [49] was adopted, which is a variant o f the DELPHI approach [46,167].…”

Section: Component Modellingmentioning

confidence: 99%

Section: Both Flotherm Andmentioning

confidence: 99%

See 1 more Smart Citation

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Eveloy¹,

Rodgers²,

Hashmi

2003

Heat Transfer: Volume 3

View full text Add to dashboard Cite

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“…We determine an effective range of the parameters. 5. We select a set of parameter values within the range.…”

Section: Development Proceduresmentioning

confidence: 99%

“…Although the Bar-Cohen-Krueger method can generate accurate results for a range of boundary conditions uniformly applied to all faces, which occurs in a fluid bath or in still air, it fails to predict the junction temperature for other boundary conditions, such as for natural or forced convection, cold plates, and heat sinks. Rosten and colleagues [5] propose a thermal characterization which is essentially independent of all practical boundary conditions. In other words, it really provides a universal thermal model of the package, that is, a boundary-condition-independent (BCI) model.…”

mentioning

confidence: 99%

Compact modeling approach using genetic algorithms for accurate thermal simulation

Koyamada

Yamada

Nishio

et al. 2000

Heat Trans. Asian Res.

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In this paper, we propose a technique that uses thermal measurement results for improved accuracy in thermal simulation of electronic apparatus. Because the modeling of the electronic components in such apparatus has hitherto been very poor, the thermal simulation results cannot achieve the required accuracy. To solve this problem, we first represent a component as a set of cubic blocks with equivalent thermal conductivity and contact thermal resistance values, and then identify these values by using the thermal measurement results for the component. We regard the identification of parameters as an optimization problem that involves minimizing the difference between the predicted and measured results. To solve the problem, we combine genetic algorithms and a thermal simulation tool. Our technique was successfully applied to the construction of an accurate thermal model, which we validated by using thermal measurement results.

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A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators

Wang

Zhang

et al. 2018

Microelectronics Reliability

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This paper investigates two compact thermal model representations for multi-chip power modules, namely the thermal impedance matrix model and the thermal admittance matrix model. The latter can shape a multi-port thermal network without controlled temperature sources, and can be readily implemented in circuit simulators from the electrical engineer point of view. The mutual transformation between the two models and their relationship to parameters in the multi-port network are revealed. In addition, practical tips regarding the temperature recording and the curve-fitting in the process of the thermal model parameter extraction is discussed. The multi-port thermal model is verified by simulations and experimental results. It confirms that accurate temperature estimation can be achieved compared with the thermal model without the thermal coupling effect.

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Final report to SEMITHERM XIII on the European-funded project DELPHI-the development of libraries and physical models for an integrated design environment

Cited by 28 publications

References 19 publications

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Compact modeling approach using genetic algorithms for accurate thermal simulation

A multi-port thermal coupling model for multi-chip power modules suitable for circuit simulators

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