The world of thermal characterization according to DELPHI-Part I: Background to DELPHI

Rosten, H.I.; Lasance, C.J.M.; Parry, John

doi:10.1109/95.650927

Cited by 78 publications

(28 citation statements)

References 18 publications

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“…By achieving BCI, the variation of the environment does not affect the actual model. The package-level compact thermal models in [4] [5] achieve BCI by finding a thermal resistance network with minimum overall error when applied to different boundary conditions [5] [7] [8]. In Section IV we show that our physical compact thermal model is BCI with reasonable accuracy.…”

Section: ) Boundary Condition Independence (Bci)mentioning

confidence: 99%

“…In addition, some lumped thermal resistances (e.g. the ones in the peripheral parts of heat spreader and heat sink, see II-A) do not fully account for all the possible heat transfer paths, thus not really representing the exact thermal resistance according to the analysis in [4] [26]. 4) Our modeling approach is not as BCI as the DELPHI and other existing modeling approaches.…”

Section: B Limitationsmentioning

confidence: 99%

“…There have been abundant existing compact thermal modeling methods in the literature. For example, the authors of [4] [5] [9] propose the DELPHI approach and introduce the important concept of boundary condition independence (BCI). The DELPHI approach extracts and optimizes a thermal resistance network from detailed model simulations under a set of standard boundary conditions.…”

Section: ) Computational Speedmentioning

confidence: 99%

“…Another important aspect of compact thermal modeling is boundary condition independence (BCI) [4] [5] [7]. Achieving BCI is essential to compact thermal models.…”

Section: Boundary Condition Independence (Bci)mentioning

confidence: 99%

“…Modeling at finer granularity introduces unnecessary details and makes the computation slower. For example, packagelevel compact thermal models, such as the DELPHI models [4] [5] [6], hide the lower level details of the package structures, including the die, the thermal attach, the solder balls and so on, mainly because these details are intellectual properties of the vendors, but also because they would just increase the complexity of the model without significantly improving the simulation accuracy. Similarly, a compact thermal model at the die level should also hide the lower level details of the die, such as the actual circuit structures and physical layout.…”

Section: Introductionmentioning

confidence: 99%

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Parameterized physical compact thermal modeling

Huang

Stan

Skadron

2005

IEEE Trans. Comp. Packag. Technol.

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Abstract-This paper presents a compact thermal modeling approach, which is fully parameterized according to design geometries and material physical properties. While most compact modeling approaches facilitate thermal characterization of existing package designs, our method is better suited for preliminary exploration of the design space at both the silicon level and the package level. We show that our modeling method achieves reasonable boundary condition independence (BCI) by comparing an example compact thermal model with a BCI model for a benchmark BGA single-chip package under the same standard set of boundary conditions. In essence, the presented compact thermal modeling method can act as a convenient medium for enhanced interactions and collaborations among designers at the package, circuit and computer architecture levels, leading to efficient early evaluations of different thermally-related design trade-offs at all the above levels of abstraction before the actual detailed design is available. The presented modeling method can be easily extended to model emerging packaging schemes such as stacked chip-scale packaging (SCP) and 3-D integration.Index Terms-compact thermal model, boundary condition independence (BCI), package design, parametrization, temperature.

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Section: ) Boundary Condition Independence (Bci)mentioning

confidence: 99%

Section: B Limitationsmentioning

confidence: 99%

Section: ) Computational Speedmentioning

confidence: 99%

“…Another important aspect of compact thermal modeling is boundary condition independence (BCI) [4] [5] [7]. Achieving BCI is essential to compact thermal models.…”

Section: Boundary Condition Independence (Bci)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Parameterized physical compact thermal modeling

Huang

Stan

Skadron

2005

IEEE Trans. Comp. Packag. Technol.

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An intelligent maintenance model to assess the condition-based maintenance of circuit breakers

Lin

Yang

2014

Int. Trans. Electr. Energ. Syst.

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SUMMARYThe circuit breaker (CB) is one of the most important equipment in power systems. CB serves as both control and protection equipment, and its operating condition is critical to the stability and reliability of power systems. CB must operate reliably to protect power systems as well as to perform tasks such as load disconnection, normal interruption and fault current interruption. As the number of equipment increases and the demand for reliability grows, many utilities switch to condition-based maintenance (CBM) for better system operation efficiency and lower operating cost. This paper proposes a CB CBM model which integrates fuzzy set theory (FST), analytical hierarchy process (AHP) and evidential reasoning (ER). Two assessment factors, i.e. (i) operating mechanism and (ii) CB lifetime, are selected as the condition parameters. A hierarchical assessment index system is constructed based on intelligent electronic device (IED) monitoring data. FST is applied to analyze the CB condition assessment indices provided by the IEDs. Data collected from questionnaires after interviews with experts are utilized by AHP to calculate factors and index weights. The ER algorithm is applied to calculate each factor by combining the indices and by combining the factors to generate the overall assessment of the CB condition. Maintenance activity is scheduled according to the CB condition assessment. Field examples are given to illustrate the application of the model in assessing CB operation conditions.

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