A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Barwicz, Tymon; Taira, Yoichi; Lichoulas, Ted W.; Boyer, Nicolas; Martin, Yves; Numata, Hidetoshi; Nah, Jae-Woong; Takenobu, Shotaro; Janta-Polczynski, Alexander; Kimbrell, Eddie L.; Leidy, Robert; Khater, Marwan; Kamlapurkar, Swetha; Engelmann, Sebastian; Vlasov, Yurii A.; Fortier, Paul

doi:10.1109/jstqe.2016.2593637

Cited by 87 publications

(26 citation statements)

References 25 publications

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“…Several processes such as manual assembly, fiber attachment, reliability testing etc. contribute to a throughput that is far less than the practical requirement [5], [6]. Thus, a significant N. Mangal, J. Missinne, G. Van Steenberge are with the Centre for Microsystems Technology, Ghent University and imec, Zwijnaarde Technologiepark 126, 9052 Ghent, Belgium (e-mail: nivesh.mangal@imec.be, jeroen.missinne@UGent.be;geert.vanSteenberge@UGent.be) N. Mangal, B. Snyder, J.…”

Section: Introductionmentioning

confidence: 99%

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics

Mangal

Snyder

Campenhout

et al. 2020

IEEE J. Select. Topics Quantum Electron.

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We demonstrate an alignment-tolerant backside coupling interface in the O-band for silicon photonics by generating an optimized through-substrate (downward) directionality beam from a TE-mode grating coupler and hybrid integrating the chip with backside silicon microlenses to achieve expanded beam collimation. The key advantage of using such an expanded beam interface is an increased coupling tolerance to lateral and longitudinal misalignment. A 34 µm beam diameter was achieved over a combined substrate thickness of 630 µm which was then coupled to a thermally expanded core single-mode fiber to investigate the tolerances. A 1-dB fiber-to-microlens lateral alignment tolerance of 14 µm and an angular alignment tolerance of 1 • was measured at a wavelength of 1310 nm. In addition, a large ±2.5 µm 1-dB backside alignment accuracy was measured for the placement of microlens with respect to the grating. The radius of curvature of Si microlens to achieve a collimated beam was 480 µm, and a 1-dB longitudinal alignment tolerance of 700 µm was measured for coupling to a single-mode expanded core fiber. The relaxation in alignment tolerances make the demonstrated coupling interface suitable for chip-to-package or chip-to-board coupling.

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Section: Introductionmentioning

confidence: 99%

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics

Mangal

Snyder

Campenhout

et al. 2020

IEEE J. Select. Topics Quantum Electron.

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show abstract

“…Single-mode waveguides circumvent intermodal dispersion and also permit dense photonic integration commensurate with the ever-increasing bandwidth density demands for photonic I/O [21,22]. They are also necessary for interfacing on-chip waveguides with standard single-mode optical fibers in photonic packaging with intermediate mode sizes and lithographically-defined waveguide arrays [23]. In biophotonic sensing, meeting the single-mode condition avoids ambiguity in data interpretation due to the coexistence of multiple modes with different overlap factors in the sensing medium [24].…”

Section: Introductionmentioning

confidence: 99%

Low loss, flexible single-mode polymer photonics

Zuo

et al. 2019

Opt. Express

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Single-mode polymer photonics is of significant interest to short-reach data communications, photonic packaging, sensing, and biophotonic light delivery. We report here experimental demonstration of mechanically flexible waveguides fabricated by using commercial off-the-shelf biocompatible polymers that claim a record low propagation loss of 0.11 dB/cm near 850 nm wavelength. We also show the excellent flexibility of the freestanding waveguides which can withstand repeated deformation cycles at millimeter bending radius without compromising their low-loss characteristics. High-performance passive optical components, such as waveguide Y-branches, multi-mode interferometers (MMIs), and waveguide crossings are also realized using the polymer photonics platform.

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“…During the past few decades, the basic building blocks of silicon photonic devices have been demonstrated: modulators, detectors, switches, filters, and lasers. One of the main challenges remaining is a packaging method to permanently attach optical fibers to the photonic chips with high optical efficiency, high speed, and maintaining compatibility with CMOS processing without introducing changes to the fabrication process or consuming significant area on the chip [1,[5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Fiber-to-chip fusion splicing for low-loss photonic packaging

Nauriyal

Song

et al. 2019

Optica

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Silicon photonic devices are poised to enter high volume markets such as data-communications, telecommunications, biological sensing, and optical phased arrays; however, permanently attaching a fiber to the photonic chip with high optical efficiency remains a challenge. We present a robust and low-loss packaging technique of permanent optical edge coupling between a fiber and a chip using fusion splicing which is low-cost and scalable to high volume manufacturing. We fuse a SMF-28 cleaved fiber to the chip via CO2 laser and reinforce it with optical adhesive. We demonstrate minimum loss of 1.0dB per-facet with 0.6dB penalty over 160nm bandwidth from 1480nm-1640nm.

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A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities

Cited by 87 publications

References 25 publications

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics

Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics

Low loss, flexible single-mode polymer photonics

Fiber-to-chip fusion splicing for low-loss photonic packaging

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