A novel checker-patterned AlN MEMS resonator as gravimetric sensor

Heidari, Amir; Yoon, Young-Gui; Lee, Man I; Khine, Lynn; Park, Mi Kyoung; Tsai, J. M.

doi:10.1016/j.sna.2012.09.027

Cited by 19 publications

(7 citation statements)

References 38 publications

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“…• WBG semiconductors can be grouped into three main categories: (i) carbon-based materials, (ii) nitride-based materials, and (iii) oxide-based materials. Among them, Figure 1 highlights some examples of WBG semiconductors that are being successful employed in MEMS sensors: diamond [6], diamond like-carbon (DLC) [7], metal-containing DLC (Me-DLC) [8], silicon carbide (SiC) [3], gallium nitride (GaN) [2], aluminum nitride (AlN) [9], and zinc oxide (ZnO) [10].…”

Section: Sicmentioning

confidence: 99%

Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material

Fraga¹,

Bosi²,

Negri³

2015

Advanced Silicon Carbide Devices and Processing

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Section: Sicmentioning

confidence: 99%

Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material

Fraga¹,

Bosi²,

Negri³

2015

Advanced Silicon Carbide Devices and Processing

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“…In recent years, the use of AlN as the piezoelectric layer in MEMS processes has been growing, mainly due to its deposition process compatibility with other manufacturing steps. Although AlN's piezoelectric coefficient is about 10 times lower that PZT, its roughly 100 times lower dielectric constant results in a comparable or even higher figure of merit for energy harvesting and sensing [8], and hence AlN has been used widely for energy harvesting, power generation, and resonator application [9], [10]. AlNbased MEMS piezoelectric vibration sensors were designed and characterized by our group and the preliminary results have been reported [11].…”

Section: Introductionmentioning

confidence: 99%

A High-Performance Piezoelectric Vibration Sensor

2017

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Abstract-We are reporting on the design, fabrication, and characterization of wideband, piezoelectric vibration microsensors. Prototypes were fabricated in a commercial foundry process. The entire thickness of the handle wafer was employed to carve the proof-mass of the device, leading to high sensitivity at a reduced chip area. A thin layer of aluminum nitride was used for sensing the displacements of the proof-mass. A continuous membrane was employed for the device structure in order to push undesired modes to high frequencies. Sensors with different geometries were designed and fabricated. Analytic and finite element analyses were conducted to study device response. A lump element model was developed for the piezoelectric vibration sensor and used for the noise modeling of the complete sensor system. Various performance metrics for the devices were characterized experimentally. Fabricated prototypes exhibited sensitivities as high as 350mV/g with first resonant frequencies of more than 10kHz. These devices are particularly suited for emerging applications in high-frequency vibration sensing.

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“…These include accelerometer, gyroscope, e-compass, altimeter, and humidity sensor. There was also a study using MEMS olfactory sensor [3][4][5][6] to monitor air pollution. 7 In order to use an inertial measurement unit (IMU) as an INS, the INS needs to be initialized from either coarse alignment or fine alignment.…”

Section: Introductionmentioning

confidence: 99%

Real-time precision pedestrian navigation solution using Inertial Navigation System and Global Positioning System

Yoon

Lee

et al. 2015

Advances in Mechanical Engineering

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Global Positioning System and Inertial Navigation System can be used to determine position and velocity. A Global Positioning System module is able to accurately determine position without sensor drift, but its usage is limited in heavily urbanized environments and heavy vegetation. While high-cost tactical-grade Inertial Navigation System can determine position accurately, low-cost micro-electro-mechanical system Inertial Navigation System sensors are plagued by significant errors. Global Positioning System is coupled with Inertial Navigation System to correct the errors, while Inertial Navigation System itself can be used to provide navigation solution during a Global Positioning System outage. Data from Global Positioning System and Inertial Navigation System can be integrated by extensive Kalman filtering, using loosely coupled integration architecture to provide navigation solutions. In this study, real-time low-cost loosely coupled micro-electro-mechanical system Inertial Navigation System/Global Positioning System sensors have been used for pedestrian navigation. Trial runs of Global Positioning System outages have been conducted to determine the accuracy of the system described. The micro-electro-mechanical system Inertial Navigation System/Global Positioning System can successfully project a trajectory during a Global Positioning System outage and produces a root mean square error of 9.35 m in latitude direction and 10.8 m in longitude direction. This technology is very suitable for visually impaired pedestrians.

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A novel checker-patterned AlN MEMS resonator as gravimetric sensor

Cited by 19 publications

References 38 publications

Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material

Silicon Carbide in Microsystem Technology — Thin Film Versus Bulk Material

A High-Performance Piezoelectric Vibration Sensor

Real-time precision pedestrian navigation solution using Inertial Navigation System and Global Positioning System

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