2021
DOI: 10.1088/1361-6501/abfc85
|View full text |Cite
|
Sign up to set email alerts
|

A novel circle center location method for a large-scale wafer

Abstract: The high-precision circle center location of a wafer can implement the automatic acquisition of the special die, which is one of the most significant steps in wafer surface defect detection. Due to the larger scale of the wafer and the smaller field of view of the camera, the circular arc edge captured is an approximate line segment and has less arc information. The existing methods are mainly used to locate the circle center of the full or more than half of the circular arc captured by a large field of view c… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
3
2

Relationship

2
3

Authors

Journals

citations
Cited by 6 publications
(3 citation statements)
references
References 37 publications
0
3
0
Order By: Relevance
“…The threshold of each binary classifier in the graylevel image is defined as follows. threshold = µ − kσ 2 (5)…”
Section: Gabor Filter-based Crack Feature Enhancementmentioning
confidence: 99%
See 1 more Smart Citation
“…The threshold of each binary classifier in the graylevel image is defined as follows. threshold = µ − kσ 2 (5)…”
Section: Gabor Filter-based Crack Feature Enhancementmentioning
confidence: 99%
“…ways to identify defects, particularly weak crack defects, on the wafer's surface automatically and removing unqualified dies to ensure the quality of subsequent products has become increasingly critical [2].…”
Section: Introductionmentioning
confidence: 99%
“…GPP wafer is a widely used material for chip manufacturing, and its reliable surface defect detection is the basis for ensuring product quality [1]. Therefore, automatic optical inspection (AOI) is often employed in the field of semiconductor chip manufacturing due to its high efficiency and reliability [2,3]. However, in the wafer AOI system, after the wafer is fed (whether manually or automatically), the wafer inevitably has a certain swing angle, that is, the angle between the die edge and the image coordinate system before the angle correction in Fig.…”
Section: Introductionmentioning
confidence: 99%