2003
DOI: 10.1016/s0378-7753(03)00397-5
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A novel cureless paste for positive plates in valve-regulated batteries

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Cited by 4 publications
(1 citation statement)
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“…Although the paste material used is generally satisfactory for the current manufacturing processes, there are still many aspects that can be improved. Recently, we have reported on using hydrogen peroxide to replace the currently used sulfuric acid [6,7]. The use of hydrogen peroxide solution to replace the conventional sulphuric acid solution can convert free lead to lead oxide during paste mixing, so that the curing process can be eliminated.…”
Section: Introductionmentioning
confidence: 99%
“…Although the paste material used is generally satisfactory for the current manufacturing processes, there are still many aspects that can be improved. Recently, we have reported on using hydrogen peroxide to replace the currently used sulfuric acid [6,7]. The use of hydrogen peroxide solution to replace the conventional sulphuric acid solution can convert free lead to lead oxide during paste mixing, so that the curing process can be eliminated.…”
Section: Introductionmentioning
confidence: 99%