A Novel High-Current Planar Inductor With Cooling Fins Based on 3-D Printing

Yu, Zheyuan; Yang, Xu; Guo, Wei; Wang, Laili; Wang, Kangping; Chen, Wenjie; Wei, Jiwen

doi:10.1109/tpel.2021.3078083

Cited by 5 publications

(2 citation statements)

References 11 publications

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“…A similar thermal path analysis was performed in [81] to design an innovative high-current planar inductor with 3D printed windings. VOLUME XX, 2017 Thermal models based on FEM are typically employed to directly compute the temperature distribution of the PMCs.…”

Section: ) Finite Element Modelingmentioning

confidence: 99%

Thermal Modeling of Planar Magnetics: Fundamentals, Review and Key Points

2023

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High-frequency and high-power density converters are essential for many applications such as automotive and more electric aircraft. To improve power density, planar magnetic components are increasingly used in power electronic converters owing to their advantages, such as less high-frequency losses, repeatability, and better thermal performance compared to conventional wound components. Considerable attention has been paid to their electrical performance. However, the thermal aspects are essential for enhancing completely their performance. Currently, there is an increasing interest in these critical aspects of high-density power converters. This paper presents a literature review of studies on the thermal modeling of planar magnetics. The papers were organized according to the model type and analyzed to highlight their merits and limitations. A multicriteria comparison of the studied papers was performed. Moreover, the key points and issues related to the thermal modeling are addressed to guide designers in enhancing the thermal aspects of planar magnetic components.INDEX TERMS Planar magnetics, High frequency magnetics, Thermal modeling, high power density.

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Section: ) Finite Element Modelingmentioning

confidence: 99%

Thermal Modeling of Planar Magnetics: Fundamentals, Review and Key Points

2023

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“…However, the fabrication of these inductors is complex and costly, posing challenges in terms of manufacturability and scalability. Most of the recent work undertaken for high current density planar inductors has focused on: 1) directly mounting bulk ferrite cores on PCB with carefully trace winding design [9,10]; 2) deposing spin-sprayed [11], laminated [12], or stencil printed [13] magnetic composites on the interposer; 3) integrating low temperature co-fired ceramic (LTCC) ferrite with PCB active layers [14][15][16][17]; and 4) implanting thin film magnetic materials into the PCB via wire bonding [18,19] or flip chip [20].…”

Section: Introductionmentioning

confidence: 99%

Adjustable High Current Low Profile Sandwich Inductor Using Nanocrystalline Flake Ribbon Core

Li,

Shillaber

et al. 2024

IEEE Open J. Power Electron.

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Compact and high current inductors determine the power density and efficiency of voltage regulators (VRs) for computing ICs. Conventional moulding structures using powder cores and gapped ferrite cores are reaching the limits of size miniaturisation. In this paper, a sandwich-structured inductor using 2D magnetic nanocrystalline flake ribbon (NFR) is developed to achieve high current density and low height. The analytical models of inductance and conduction losses are developed and validated by finite element methods and experiments. A 5 to 1 V, 50A, VR is built to compare the performance of the fabricated NFR sandwich inductor to the latest commercial counterpart. Thermal performance is investigated, stability tests under solder iron heat and reflow temperature are performed. The fabricated sandwich inductor is featured as simple structure, low profile, low DC resistance (DCR), high saturation current, soldering heat stable, but in the modest compromise of the AC conduction and core losses.T

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