A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging

Abstract

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically decoupled proof masses (PM) with synchronization structures, a symmetrically decoupled lever structure is designed to force the antiparallel, antiphase drive mode motion and eliminate low frequency spurious modes. Thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly coupled, momentum- and torque-balanced antiphase sense mode. Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the wafer-scale sensing structures. A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances. It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51,947 and 49,249, respectively. This TFG realizes a wide measurement range of ±1800 °/s and a high resolution of 0.1°/s with a scale factor nonlinearity of 720 ppm after automatic mode matching. In addition, long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.

Unlocking the potential of piezoelectric films grown on vertical surfaces for inertial MEMS

“…In addition, in recent MEMS modeling works this parameter was assumed to be between 10,000 and 30,000 [21][22][23]. However, in analytical calculations for the high-quality sensors, Q-factor can even reach 50,000 [24]. Thus, the quality factor for the proposed simulation was estimated as 20,000, while the remaining parameters are presented in Table 3.…”

Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial Mems

“…In addition, in recent MEMS modeling works this parameter was assumed to be between 10,000 and 30,000 [21][22][23]. However, in analytical calculations for the high-quality sensors, Q-factor can even reach 50,000 [24]. Thus, the quality factor for the proposed simulation was estimated as 20,000, while the remaining parameters are presented in Table 3.…”

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

“…To investigate the impacts of gyroscopes' internal stresses and the packaging stresses on ZRO drift at the thermal start-up stage, self-developed high-Q dual-mass TFGs [18], fabricated with through-silicon-via (TSV) and glass-in-silicon (GIS) reflow techniques [19], are adopted in this work.…”