A novel in-field TSV repair method for latent faults

Abstract

The aging effect due to the electromigration (EM) may result in faulty Through-silicon vias (TSVs) and affect the three-dimensional integrated circuits (3D ICs) lifetime. To design a flexible and efficient structure, in this paper, we enhance the region-based design for latent TSV faults, which can adjust the size of the TSV block and TSV redundancy. Experimental results demonstrate that the design can achieve 11.27% and 20.79% reduction of additional delay overhead as compared with router-based design and ring-based scheme, respectively. More importantly, when the target year is 3 years, the design can achieve above 99% reparability for all sizes of TSV blocks. After a given 5-year lifetime, the reparability of the proposed regionbased design can still achieve 99% reparability when the TSV size is lower than 16 * 16, which is the best choice by considering RTSV area and delay overhead.

TSV-based SIW bandpass filter for W-band mobile communication applications

“…The traditional waveguide filter has the characteristics of high quality factor and low insertion loss, but it is difficult to integrate with monolithic circuit due to its weight and area [1,2]. In the past few years, substrate integrated waveguide filters have attracted special attention, which is usually realized by introducing metal through holes into dielectric substrates [3][4][5]. The microwave filter based on SIW not only ensures excellent performance, but also is easy to integrate and small in size [6].…”

An enhanced time-to-digital conversion solution for pre-bond TSV dual faults testing

“…Testing for manufacturing defects is inherently important to ensure the required product quality since one single defect in a TSV may damage the entire 3D IC. Hence, TSVs need to be thoroughly tested to enhance their yield and reliability [2,3,4,5,6]. Pre-bond TSV testing is always one of the main challenges in 3D-IC test flow due to the limited TSV accessibility.…”