In this paper, for the first time, monolithic integration of an RF MEMS switch matrix is presented. Novel SP3T RF MEMS switches are designed and monolithically integrated with an electromagnetically coupled interconnect network. A thin film fabrication process exclusively for this purpose is developed and fine tuned. A prototype unit of a 3 x 3 monolithic switch matrix is fabricated and tested. The measured results show a good RF performance for the frequency range of 9.5GHz to 13.5GHz. The proposed monolithic 3 X 3 switch matrix can be easily expanded to a larger matrices using Clos networks.