A Novel Method of Etching Copper Oxide Using Acetic Acid

Chávez, K.; Hess, Dennis W.

doi:10.1149/1.1409400

Cited by 253 publications

(200 citation statements)

References 12 publications

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“…21 CVD using conventional copper foil catalysts normally involves removal of the native oxide prior to graphene growth, for examplem by treatment with acetic acid 21 or (NH 4 ) 2 S 2 O 8 . By contrast, the peeled-off catalyst surface is formed in a chemically pure state and only begins to oxidize slowly upon exposure to air.…”

Section: Articlementioning

confidence: 99%

Chemical Vapor Deposition of Graphene on a “Peeled-Off” Epitaxial Cu(111) Foil: A Simple Approach to Improved Properties

Balasubramanian

Kim

et al. 2014

ACS Nano

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We present a simple approach to improving the quality of CVD grown graphene, exploiting a Cu(111) foil catalyst. The catalyst is epitaxially grown by evaporation on a single crystal sapphire substrate, thickened by electroplating, and peeled off. The exposed surface is atomically flat, easily reduced, and exclusively of (111) orientation. Graphene grown on this catalyst under atmospheric CVD conditions and without wet chemical prereduction produces single crystal domain sizes of several hundred micrometers in samples that are many centimeters in size. The graphene produced in this way can easily be transferred to other substrates using well-established techniques. We report mobilities extracted using field-effect (as high as 29 000 cm2 V–1 s–1) and Hall bar measurement (up to 10 100 cm2 V–1 s–1).

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Section: Articlementioning

confidence: 99%

Chemical Vapor Deposition of Graphene on a “Peeled-Off” Epitaxial Cu(111) Foil: A Simple Approach to Improved Properties

Balasubramanian

Kim

et al. 2014

ACS Nano

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“…Their presence was also identified using the Auger electron peaks (Cu LMM). 29,30 The amount of Cu 2 O relative to Cu 0 was greater after desmutting with added CeCl 3 and CeCl 3 + H 2 O 2 than with nitric acid alone (Table III).…”

Section: Resultsmentioning

confidence: 96%

Characterization of 2024 T3 Aluminum Alloy after Rare Earth Desmutting

Gordovskaya

Curioni

Hashimoto

et al. 2016

J. Electrochem. Soc.

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The effect of CeCl 3 and CeCl 3 + H 2 O 2 additions to a nitric acid solution for desmutting of 2024 T3 aluminum alloy has been investigated using scanning electron microscopy and energy dispersive X-ray analysis, potentiodynamic polarization and X-ray photoelectron spectroscopy. No S-, θ-phase and Al-Cu-Fe-Mn-(Si) particles were detected on the alloy surface after desmutting with added CeCl 3 . A similar result was attained with addition of H 2 O 2 , although with slower removal of the particles. In contrast, θ-phase, Al-Cu-Fe-Mn-(Si) and dealloyed S-phase particles remained following desmutting in nitric acid alone. The absence of the particles on the alloy surfaces following desmutting in the presence of CeCl 3 was also confirmed by potentiodynamic anodizing of the alloy in H 2 SO 4 solution. Surface pre-treatment of aluminum alloys is important for improvement in the properties and the anticorrosion performance of anodic films and conversion coatings used in the aerospace industry. 1The main purpose of the pre-treatment is to prepare a reproducible, chemically active surface for application of the subsequent treatment. The pre-treatment of the alloys involves several steps, including degreasing, acid or alkaline etching and desmutting.Enhanced mechanical properties of the alloys are achieved by addition of alloying elements that form second phase particles.2,3 The presence of cathodically active intermetallics on the alloy surface sustains cathodic reactions that cause susceptibility to corrosion due to microgalvanic coupling between the intermetallics and the aluminum matrix and the associated alkiline corrosion. Porous anodic films formed on Al-Cu alloys are less regular than films produced on high purity aluminum due to the incorporation of copper into the film and oxygen evolution during anodizing. 4 Furthermore, the anodic layer formed on the intermetallic particles has an altered morphology and contains various defects, thus providing reduced corrosion protection compared with the aluminum matrix. [5][6][7] For the last two decades, rare earth metals (cerium, neodymium and lanthanum) have been investigated in surface treatments for enhancing the corrosion resistance of anodized aluminum alloys. [8][9][10] The treatments can reduce the number of residual cathodic intermetallic particles on the alloy surface and hence enable formation of an anodic film that contains fewer defects. In this regard, relatively little information about cerium-containing desmutting solutions has been published. 8,[11][12][13] Hughes et al. Subsequently, Hughes et al. 12 and Kimpton et al. 13 investigated a lower etch rate cerium-containing desmutter (0.5 M H 2 SO 4 + 0.05 M (NH) 4 Ce(SO 4 ) 4 · 2 H 2 O) for pre-treatment of 2024 T3 and 7075 T6 aluminum alloys, which was shown to improve the performance of subsequently applied cerium conversion coating.In the present work, alkaline etching followed by desmutting in nitric acid with CeCl 3 and CeCl 3 / H 2 O 2 additions are investigated for the removal of intermetallics from th...

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“…In addition to the peak at 932.9 eV, the Cu 2p 3/2 spectra recorded for the deposits formed at 0.00 and À0.10 V vs SCE showed peaks at 935.1 and 934.9 eV, respectively, which are typical of Cu(OH) 2 with its corresponding satellite peaks. 42 Considering that XPS probes the top 10 nm of the sample surface, a very thin layer of Cu(OH) 2 must be present on the deposits surface. The Cu 2p 3/2 signals observed from the deposits formed at 0.00 and À0.10 V are nearly identical to those reported by Yin et al for Cu 2 O nanocrystals.…”

Section: ' Introductionmentioning

confidence: 99%

Electrochemical Fabrication of Copper-Based Hybrid Microstructures and Mechanism of Formation of Related Hierarchical Structures on Polypyrrole Films

et al. 2011

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The surface electrochemistry of polypyrroleÀ polystyrene sulfonate (PPyÀPSS) thin films is exploited for the fabrication of novel hybrid copper-based microstructures. The electrochemical deposition of the copper-based materials at the PPyÀPSS film is strongly dependent on the electrode potential. This dependence is studied at three different potentials: 0.10, 0.00, and À0.10 V vs SCE. Hierarchical micro/nanostructures made of copper hydroxysulfate salts are only formed at 0.10 V vs SCE and are replaced with branched and single microcrystals of Cu 2 O covered by a thin layer of Cu(OH) 2 at 0.00 and À0.10 V vs SCE, respectively. The different structures can be coupled on the same film through a simple fabrication procedure to give hybrid microstructures. These novel hybrids consist of a central microcrystal (deposited at À0.10 V vs SCE) and a surrounding contour of welded nanosheets (deposited at 0.10 V vs SCE). The mechanism of nucleation and growth of the hierarchical micro/ nanostructures formed at 0.10 V vs SCE is also reported. These structures are made from the assembly of nanoparticles into nanowires, nanosheets, and microclusters. These microclusters have a flowerlike shape within which each nanosheet forms a petal of the flower. The nucleation of the clusters is shown to be progressive.

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A Novel Method of Etching Copper Oxide Using Acetic Acid

Cited by 253 publications

References 12 publications

Chemical Vapor Deposition of Graphene on a “Peeled-Off” Epitaxial Cu(111) Foil: A Simple Approach to Improved Properties

Chemical Vapor Deposition of Graphene on a “Peeled-Off” Epitaxial Cu(111) Foil: A Simple Approach to Improved Properties

Characterization of 2024 T3 Aluminum Alloy after Rare Earth Desmutting

Electrochemical Fabrication of Copper-Based Hybrid Microstructures and Mechanism of Formation of Related Hierarchical Structures on Polypyrrole Films

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