2021
DOI: 10.1109/tcpmt.2021.3049495
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A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air Through Printing Al Electrode and Reduction-Oxidation Substitution Reaction

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Cited by 3 publications
(1 citation statement)
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“…In this work, a cost-efective aluminum paste is used in place of the prohibitively expensive nanosilver paste and other copper paste substitutes that are typically used in classic thick flm processes [6,7]. Te most abundant metal on Earth (after silicon and oxygen) is aluminum, which is printed onto a fexible PET substrate sheet using an epoxy resin paste [8,9]. However, since the Al paste with epoxy resin is nonconductive, the thick flm aluminum electrode, which was screen printed and had a higher oxidation potential, was immersed in an aqueous solution of CuSO 4 for a certain duration.…”
Section: Introductionmentioning
confidence: 99%
“…In this work, a cost-efective aluminum paste is used in place of the prohibitively expensive nanosilver paste and other copper paste substitutes that are typically used in classic thick flm processes [6,7]. Te most abundant metal on Earth (after silicon and oxygen) is aluminum, which is printed onto a fexible PET substrate sheet using an epoxy resin paste [8,9]. However, since the Al paste with epoxy resin is nonconductive, the thick flm aluminum electrode, which was screen printed and had a higher oxidation potential, was immersed in an aqueous solution of CuSO 4 for a certain duration.…”
Section: Introductionmentioning
confidence: 99%