This paper presents the optimization of a one-transistor active pixel sensor (1T-APS), known as the photoelectron in-situ sensing device (PISD) built in a fully-depleted silicon-on-insulator (FD-SOI) substrate. By employing TCAD simulation, we develop a physics-based model and systematically investigate the impact of six key parametersgate oxide thickness, buried oxide layer, top Si layer, gate length, length of active region, and substrate dopingon the device's sensitivity and sensing range. Our comprehensive study provides guidance on the design of the PISD with the highest performance.