A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Abstract

In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeterwave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.

Millimeter-Wave Power Amplifier Integrated Circuits for High Dynamic Range Signals

“…Growth of GaN on Silicon substrates is now widely practiced. Recent work has shown that CMOS-like processing can be done with GaN-on-Si to produce nitride-based ICs, followed by wafer bonding to CMOS ICs [147]. It can be anticipated that if sufficient market demand develops, heterogenous integration will become cost-effective such that PA designers can explore benefits of both CMOS and III-V technologies in their solutions.…”

Designed on 0.18 μm CMOS Process Small Size Broadband Millimeter Wave Chip Antenna

“…In recent years, with the transformation of mobile communication networks, more and more research has been conducted on the frequency bands of millimeter wave communication systems, including n257 (26.5-29.5 GHz), n258 (24.2-27.5 GHz), n259 (39.5-43.5 GHz), n260 (37-40 GHz), and n261 . Implementing highperformance, low-cost, and low-power transceivers has become an important research topic [6]. In addition to the above frequency bands, scientists are also actively studying the 60 GHz and 77 GHz communication frequency bands and applying them in the fields of industry, medical treatment, and automotive radar [7].…”

Development of innovative substrate and embedding technologies for high frequency applications

“…5G wireless communication networks have already been developed and are expected to dramatically reshape the wireless communication landscape. Nevertheless, a number of technical challenges still need to be addressed in the most recent packaging development approaches, such as the implementation of a large number of connections at high data rates, exhibiting high gain to compensate for the high free space loss at millimeter wave frequencies [12]. In particular, in Serena project, PCB embedding technology offers the potential to realize an integrated RF electronics module containing ICs for RF signal generation and antennas with very short interconnects in a single package, thus minimizing the signal path losses.…”