2021
DOI: 10.1016/j.solener.2021.09.083
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A novel passivating electron contact for high-performance silicon solar cells by ALD Al-doped TiO2

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Cited by 31 publications
(33 citation statements)
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“…Furthermore, wide-bandgap materials are also beneficial in realizing the large asymmetry between electron and hole conductivity, thus realizing superior charge carrier selectivity. [2] Up to now, a lot of metal compounds, such as metal oxides, [10][11][12][13] fluorides, [14][15][16] nitrides, and oxynitride, [17][18][19] have been reported as efficient electron transport layers for c-Si solar cells. They typically have a small conduction band offset (ΔE C ) and large valance band offset (ΔE V ) with c-Si.…”
mentioning
confidence: 99%
“…Furthermore, wide-bandgap materials are also beneficial in realizing the large asymmetry between electron and hole conductivity, thus realizing superior charge carrier selectivity. [2] Up to now, a lot of metal compounds, such as metal oxides, [10][11][12][13] fluorides, [14][15][16] nitrides, and oxynitride, [17][18][19] have been reported as efficient electron transport layers for c-Si solar cells. They typically have a small conduction band offset (ΔE C ) and large valance band offset (ΔE V ) with c-Si.…”
mentioning
confidence: 99%
“…In a separate work, Liu et al varied the Al:Ti cycle ratio to form Al‐doped TiO 2 films, obtaining an effective minority carrier lifetime τ eff of 1.9 ms and contact resistivity ρ c of 100 mΩ cm 2 on Si using an optimized Al 0.20 Ti 0.36 O layer with LiF/Al contacts, after annealing at 300 °C. [ 14 ] Although doping with aluminum was found to improve surface passivation quality and reduce contact resistivity in this case, the obtained contact resistivity was still relatively high (100 mΩ cm 2 ). In addition, we believe that the use of the transmission line measurement (TLM) method to measure contact resistivity makes the obtained contact resistivity values unreliable due to the high film thickness (16.5 nm).…”
Section: Introductionmentioning
confidence: 96%
“…In this context, even for silicon technology that has been studied since the 1950s, new approaches with selective contacts for electron or holes are being developed. [6][7][8][9][10] To understand the impact of interface properties, researchers combine information from different characterization techniques, each one with its merits and limitations. Examples include microscopy techniques such as scanning and transmission electron microscopy, for morphology, Raman spectroscopy and As devices become smaller and more complex, the interfaces between adjacent materials become increasingly important and are often critical to device performance.…”
Section: Introductionmentioning
confidence: 99%
“…In this context, even for silicon technology that has been studied since the 1950s, new approaches with selective contacts for electron or holes are being developed. [ 6–10 ] To understand the impact of interface properties, researchers combine information from different characterization techniques, each one with its merits and limitations. Examples include microscopy techniques such as scanning and transmission electron microscopy, for morphology, Raman spectroscopy and grazing incident angle X‐ray diffraction, for structure, time resolved photoluminescence and admittance electrical measurements, for charge carrier dynamics, X‐ray photoelectron spectroscopy, and secondary‐ion mass spectrometry, for composition, among others, where of course, final devices are the ultimate tool for performance evaluation.…”
Section: Introductionmentioning
confidence: 99%