A minimalist approach to integration yields tandem solar cells with high efficiency.

Mixed‐dimensional perovskite solar cells combining 3D and 2D perovskites have recently attracted wide interest owing to improved device efficiency and stability. Yet, it remains unclear which method of combining 3D and 2D perovskites works best to obtain a mixed‐dimensional system with the advantages of both types. To address this, different strategies of combining 2D perovskites with a 3D perovskite are investigated, namely surface coating and bulk incorporation. It is found that through surface coating with different aliphatic alkylammonium bulky cations, a Ruddlesden–Popper “quasi‐2D” perovskite phase is formed on the surface of the 3D perovskite that passivates the surface defects and significantly improves the device performance. In contrast, incorporating those bulky cations into the bulk induces the formation of the pure 2D perovskite phase throughout the bulk of the 3D perovskite, which negatively affects the crystallinity and electronic structure of the 3D perovskite framework and reduces the device performance. Using the surface‐coating strategy with n‐butylammonium bromide to fabricate semitransparent perovskite cells and combining with silicon cells in four‐terminal tandem configuration, 27.7% tandem efficiency with interdigitated back contact silicon bottom cells (size‐unmatched) and 26.2% with passivated emitter with rear locally diffused silicon bottom cells is achieved in a 1 cm2 size‐matched tandem.

The reduction of parasitic recombination processes commonly occurring within the silicon crystal and at its surfaces is of primary importance in crystalline silicon devices, particularly in photovoltaics. Here we explore a simple, room temperature treatment, involving a nonaqueous solution of the superacid bis(trifluoromethane)sulfonimide, to temporarily deactivate recombination centers at the surface. We show that this treatment leads to a significant enhancement in optoelectronic properties of the silicon wafer, attaining a level of surface passivation in line with state-of-the-art dielectric passivation films. Finally, we demonstrate its advantage as a bulk lifetime and process cleanliness monitor, establishing its compatibility with large area photoluminescence imaging in the process.

Passivating contacts based on transition metal oxides (TMOs) have the potential to overcome existing performance limitations in high‐efficiency crystalline silicon (c‐Si) solar cells, which is a significant driver for continuing cost/Watt reductions of photovoltaic electricity. Herein, innovative stacks of Al‐alloyed TiO x (Al y TiO x ) and pure TiO x as transparent electron‐selective passivating contacts for n‐type c‐Si surfaces are explored. An optimized stack of 2 nm Al y TiO x and 2 nm TiO x is shown to provide both record‐quality surface passivation and excellent electrical contact, with a surface recombination current density prefactor J 0 of 2.4 fA cm−2 and a specific contact resistivity ρ c of 15.2 mΩ cm2. The performance of this innovative stack significantly exceeds previously reported values for pure or doped TiO x single layers, SiO x /TiO x stacks, a‐Si:H/TiO x stacks, and other transparent contact technologies. Furthermore, an excellent efficiency of 21.9% is attained by incorporating the optimized stack as a full‐area rear contact in an n‐type c‐Si solar cell. The findings set a new benchmark for the passivation performance of metal oxide‐based passivating contacts, bringing it to a level on par with state‐of‐the‐art SiO x /poly‐Si contacts while greatly improving optical transparency.

Efficient and stable electron selective materials compatible with commercial production are essential to the fabrication of dopant-free silicon solar cells. In this work, we report an air-stable TiN (titanium nitride) polycrystalline film, deposited using radio frequency sputtering process, as an electron selective contact in silicon solar cells. TiN films deposited at 300 W and 1.5 mTorr exhibit a low contact resistivity of 2.0 mΩ·cm2. Furthermore, the main factors and mechanisms affecting the carrier selectivity properties are also explored. TiN layers as full area rear electron contacts in n-type silicon solar cells have been successfully implemented, even though TiN film contains some oxygen. This process yields a 17% increment in relative efficiency in comparison with reference devices (n-Si/Al contact). Hence, considering the low thermal budget, scalable technique, and low contact resistivity, the TiN layers can pave the way to fabricate high-efficiency selective contact silicon solar cells with a higher degree of reproducibility.