A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide

Sato, Ken-ichi; Harada, S.; Saiki, Atsushi; Kimura, Takeshi; Okubo, T.; Mukai, K.

doi:10.1109/tphp.1973.1136727

Cited by 92 publications

(22 citation statements)

References 1 publication

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“…[2][3][4] It shows that polyimide with 1970s. 1 To apply polymers in the semiconductor rigid-rod-like main chains has a smaller lateral industry, they should have high glass transition CTE than that of polyimide with flexible main temperature (T g ) to be compatible with high temchains. In addition, Liou et al have shown that perature processes, and good thermal and merigid-rod-like polyimide has smaller vertical CTE chanical properties to prevent the delamination than flexible polyimide.…”

Section: Introductionmentioning

confidence: 99%

The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers

Liou

McKerrow

1998

J. Polym. Sci. B Polym. Phys.

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Section: Introductionmentioning

confidence: 99%

The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers

Liou

McKerrow

1998

J. Polym. Sci. B Polym. Phys.

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“…[1][2][3][4][5] Aromatic polyimides (PIs) are well known high-performance polymeric materials owing to their excellent thermal stability and balanced mechanical and electrical properties. [6][7][8][9][10] These materials are finding many applications as adhesives, composites, fibers, films and electrical materials. These aromatic polyimides are suitable for preparing multilayer thin films.…”

Section: Introductionmentioning

confidence: 99%

Polyimide multilayer thin films prepared via spin coating from poly(amic acid) and poly(amic acid) ammonium salt

Choi

et al. 2008

Macromol. Res.

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Polyimide (PI) multilayer thin films were prepared by spin-coating from a poly(amic acid) (PAA) and poly(amic acid) ammonium salt (PAAS). PI was prepared from pyromellitic dianhydride (PMDA) and 4,4'-oxydianiline (ODA) PAA. Different compositions of PAAS were prepared by incorporating triethylamine (TEA) into PMDA-ODA PAA in dimethylacetamide. PI multilayer thin films were spin-coated from PMDA-ODA PAA and PAAS. The PAAS comprising cationic and anionic moieties were spherical with a particle size of 20~40 nm. Some particles showed layers with ammonium salts, despite poor ordering. Too much salt obstructed the interaction between the polymer chains and caused phase separation. A small amount of salt did not affect the interactions of the interlayer structure but did interrupt the stacking between chains. Thermogravimetric analysis (TGA) showed that the average decomposition temperature of the thin films was 611 o C. All the films showed almost single-step, thermal decomposition behavior. The nanostructure of the multilayer thin films was confirmed by X-ray reflectivity (XRR). The LF 43 film, which was prepared with a 4:3 molar ratio of PMDA and ODA, was comprised of uniformly spherical PAAS particles that influenced the nanostructure of the interlayer by increasing the interaction forces. This result was supported by the atomic force microscopy (AFM) data. It was concluded that the relationship between the uniformity of the PAAS particle shapes and the interaction between the layers affected the optical and thermal properties of PI layered films.

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“…[1][2][3][4][5] In order to fabricate a high performance chip, however, solutions to some problems should be addressed. One is about the dielectric performance.…”

Section: Introductionmentioning

confidence: 99%

“…[9][10][11][12][13] Among some cage structured molecules, adamantane (tricyclo [3,3,1,1] decane) is characterized by fused chair-form cyclohexane ring structure. 14,15 As this substance has high thermal and oxidation resistance, it has ever been inserted into the backbone of a few polymeris systems, e.g., polyimides, polysulfones, polyesters, and polyamides [16][17][18][19][20][21][22][23] to increase the thermal and oxidative stability.…”

mentioning

confidence: 99%

Physical Properties and Stress Analysis of Low Dielectric Polyimide Films Containing Adamantane Pendant Group

Yoo

Lim

Yoon

et al. 2003

Polym J

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ABSTRACT:Low dielectric polyimides were synthesized from a new diamine, bis(4-aminophenyl)-1-adamantyl phosphine oxide (DAAPO) containing adamantane cage structured group in the pendant position. Thermomechanical properties were investigated using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and thermomechanical analyzer (TMA). The thickness dependence of dielectric constant was measured using a LCR meter, and the results were compared with those of other polyimide systems reported. Variation of stress during film coating and annealing processes was analyzed using a bending beam curvature measurement system complemented with an in-situ film thickness measurement system, the interferometer. Stress was developed as solvent evaporated during film baking process, and the residual stress was obtained when the coated films were prepared. The stress behavior was significantly affected by ramping and annealing schedules.KEY WORDS Polyimide / Dielectric Constant / Adamantane / Cage Structure / Stress / Aromatic polyimides have been used as dielectric, coating, and adhesive layers in microelectronics fabrications, because they have excellent electrical, chemical, thermal, and mechanical properties compared to other organic polymers. [1][2][3][4][5] In order to fabricate a high performance chip, however, solutions to some problems should be addressed. One is about the dielectric performance. As dielectric constants of commercial polyimides (PIs) are reported to be higher than 3, it should be lowered to transport more signals through more integrated circuits. The residual stress is another problem, especially in the thin polymer film application for chip and wire packaging. Stress is usually developed by thermal expansion difference between the film and substrate. Organic/inorganic pairs like PI/silicon wafer imposed high stress due to relatively high thermal expansion difference. When it is considerable in multiplayer fabrication process, it sometimes results in cracking, delamination, or bending of films.Among many trials to reduce the dielectric constant and residual stress, one has recently proposed introduction of nano or molecular foams in PI matrix. This was based on the idea that the dielectric constant of air is close to 1 and that the stress is significantly affected by relative density of polymer foams, ρ/ρ 0 ; moduli of foams are known to be proportional to (ρ/ρ 0 ), 2, 6 under the circumstances that thermal expansion coefficients of bulk and foam polymers are almost the same. More than 10 year trials for insertion of nano or molecular foams in PIs are summarized by two approaches: i) the phase separation by heat and non-solvent during preparation of PI systems, 7 and ii) the synthesis of block copolymer composed of polyimide and thermally degradable polymer. 8 Thermal degradation of the second component leaves nano-scaled pores behind it. Not many of these, however, were successfully industrialized, because their preparation process was too complicated and the resulting material pr...

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A Novel Planar Multilevel Interconnection Technology Utilizing Polyimide

Cited by 92 publications

References 1 publication

The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers

The effect of crosslinking on thermal and mechanical properties of perfluorocyclobutane aromatic ether polymers

Polyimide multilayer thin films prepared via spin coating from poly(amic acid) and poly(amic acid) ammonium salt

Physical Properties and Stress Analysis of Low Dielectric Polyimide Films Containing Adamantane Pendant Group

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