A Novel Self‐Healing Polyurethane Based on Disulfide Bonds

Abstract

Polymeric materials with intrinsic self-healing ability that can restore from mechanical injury autonomously have attracted great research efforts recently. Disulfi de bonds, which become dynamic upon exposure to heat, UV light, or redox conditions, can be used to introduce healable properties to polymer network. Shape memory effect is a kind of auxiliary recovery force that can accelerate healing process. In this work, a polyurethane material combines disulfi de link and shape memory effect is synthesized. Autonomous healing of a crack takes place upon heating above 80 °C and leads to almost fully recovery of mechanical properties. This healing is achieved by activating shape memory effect and disulfi de exchange reaction simultaneously.

Heat‐triggered poly(siloxane‐urethane)s based on disulfide bonds for self‐healing application

“…Huynh and Haick provided a multifunctional self‐healing sensing device, and the self‐healing mechanism of the substrate and electrodes is based on reformation of hydrogen and disulfide bonds between polymer chains at two sides of the cut . Xu and Chen prepared a self‐healing polyurethane (PU) material based on disulfide bonds by heating …”

A Robust and High Self‐Healing Efficiency Poly(Urea‐Urethane) Based on Disulfide Bonds with Cost‐Effective Strategy

“…Moreover, SPU showed a slow decline of storage modulus and a slight transition of tan δ corresponding to the T g of the soft segments, which means the existence of microphase separation in the SPU sample. It is worth mentioning that when the temperature was increased above 120 °C, the tan δ of SPU began to rise rapidly, which implied that the quadruple hydrogen bondings were rapidly dissociated …”

“…However, to the best of our knowledge, the disulfide‐containing chain extenders used in the related studies were purchased directly and the prices were very expensive, such as bis(2‐hydroxyethyl) disulfide, bis(4‐aminophenyl)disulfide, and bis(4‐hydroxyphenyl) disulfide, which limited further applications in practice of scientific study and production. It is still a challenge to develop a low‐cost chain extender by simple and fast route containing disulfide bonds for the preparation of self‐healing poly(urea‐urethane).…”

Biodegradable Viral Nanoparticle/Polymer Implants Prepared via Melt-Processing

“…Disulfide bond dissociation has been observed in the range of 80–160 °C in solid-state rubber vulcanization and self-healing materials. 41,42 The endothermic peak at 236 °C can be attributed to the dissociation of coat protein dimers and denaturation of the coat proteins. Previous DSC studies of lysozyme, glycinin, and human growth hormone in the solid-state have indicated protein denaturation over temperature ranges of 180–200 °C.…”

“…Integration of the first endothermic peak on the DSC thermogram (from 84 to 172 °C) as shown by the equation below, which is speculated to be disulfide breakup, yielded a value of 43,860 kJ/mol particle in good agreement with the theoretical value. 41,42 $$E_{\text{disulfide}}=\left({\text{MW}}_{\mathrm{Q}\beta }\right){\left(\frac{\mathrm{normal\Delta }T}{s}\right)}^{-1}true{\int }_{T_1}^{T_2}\left(\frac{W}{g}\right)dT$$where E disulfide is the total enthalpy of disulfides per mole of particle (J/mol Q β ), MW Q β is the molecular weight of Q β = 2,556,000 g/mol, Δ T / s is the heating rate of the DSC study, 0.333 K/s, and mW / g is the heat flux of the DSC sample per gram (W/g).…”