A novel technique for modeling solder joint failure during system level drop simulations

Carroll, Doug; Bates, C.; Zampino, M. A.; Jones, K.L.

doi:10.1109/itherm.2006.1645437

Cited by 7 publications

(3 citation statements)

References 3 publications

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“…Carroll et al [88,89] demonstrated that the solder ball assembly can be modeled as one-dimensional fastener element whose mechanical characteristics are generated using a comprehensive model. Results were validated with experiment and showed good agreement with a detailed model.…”

Section: Finite Elementmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

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Section: Finite Elementmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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“…Although experimental correlation at the PCB level (strainbased) was often satisfactory, there was not enough evidence showing that the beam theory simplification could capture plasticity and rate sensitive effects in the solder material accurately when compared to a detailed solder joint model. Carroll et al [14] presented a new modeling technique for solder joints using a fastener model with connector elements in ABAQUS [9]. The fastener model is a convenient modeling method to define a point-to-point connection (in this case, represents solder interconnection) between two surfaces using connector elements and distributing coupling constraints.…”

Section: Finite Element Modelingmentioning

confidence: 99%

“…For simplicity, the assumption was made that the material behavior in each loading direction was independent of each other. The procedure on how to derive the material model is detailed elsewhere [14]. The connector model was shown to be capable of accurately capturing the material plasticity and rate dependent effects from a detailed solder joint model with just a fraction of the computational effort.…”

Section: Finite Element Modelingmentioning

confidence: 99%

The effect of pcb flexural modes on dynamic reliability of ball grid array packages

Towashiraporn

Crosbie

Lee

2008

2008 58th Electronic Components and Technology Conference

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To enable richer consumer experiences, more IC chipsets with various functionalities and greater memory density have been deployed in the limited phone board area. A new generation of surface mount devices such as fine pitch BGA, package-on-package (POP), and wafer-level packaging, are being introduced to reduce board area for the given feature set. Board level reliability of new packages is one of the most important aspects to system performance under impact loadings. The dynamic reliability characterization of the components has been used as a basis for predicting a system (phone) level reliability. Package characterization methodologies must be designed to capture the interconnect failure modes of the actual IC packages commonly encountered in phone drop conditions for better prediction of phone-level reliability.Strain gage measurements and finite element analysis (FEA) of drop tests performed on portable electronic devices revealed mixed printed circuit board (PCB) flexural modes during impact. Dynamic planar and spherical bend tests were developed to study the effect of PCB bend mode on solder interconnect reliability. In the present study, a planar flexural mode was generated through utilization of a 4-point bend test fixture, and a spherical bend test was developed to achieve an equi-biaxial strain state at the vicinity of a corner solder joint as opposed to predominantly uni-directional strain state in four-point bend test. A failure prediction model based on connector finite element modeling was developed to understand the significantly different solder joint reliability under the two loading conditions. The ability of the new modeling technique to accurately predict failure of solder joints under different loading conditions was appreciated showing excellent agreement to failure analysis of actual test samples. The new methodology can enable efficient and accurate means of assessing package reliability under various conditions that simulate portable electronic devices being dropped in the field. IntroductionWith increasing awareness of the ability for electronic packages to sustain a certain amount of drop/impact loading in the field, strain-based quantity is increasingly being used during component qualification. The component has to meet strain-based requirement that can be induced by qualified drop tests. As metrologies for dynamic bend testing are proliferating quickly, it is important that testing methodologies are able to capture the loading conditions which the package is to be subjected to in the field in order to provide meaningful data for an evaluation of the allowable strain for the component. A number of studies [1, 2] were conducted to evaluate the effect of package orientation with

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