A Novel Vertical Wire-Bonding Compensation Structure Adaptively Modeled and Optimized With GRNN and GA Methods for System in Package

Zhu, Hongying; Zhao, Ya-Li; Lu, Jiaguo

doi:10.1109/temc.2021.3064853

Cited by 12 publications

(2 citation statements)

References 24 publications

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“…Therefore, GA can efficiently perform the collaborative optimization of multiple parameters. Zhu et al [ 77 ] proposed a kind of ANN and GA wire-bonding interconnect performance optimization method, with the optimal time reduced to 0.2 from 7.63 h, and improved the optimization efficiency. Odaira et al [ 78 ] created an eye diagram based on the GA optimization method, where the proposed methods were be elevated and eyes width increased 3.07 times and 1.06 times, respectively.…”

Section: Intelligent Optimization Methods For Microsystem Designmentioning

confidence: 99%

Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems

Shan

Wang

et al. 2023

Micromachines

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Microsystems are widely used in 5G, the Internet of Things, smart electronic devices and other fields, and signal integrity (SI) determines their performance. Establishing accurate and fast predictive models and intelligent optimization models for SI in microsystems is extremely essential. Recently, neural networks (NNs) and heuristic optimization algorithms have been widely used to predict the SI performance of microsystems. This paper systematically summarizes the neural network methods applied in the prediction of microsystem SI performance, including artificial neural network (ANN), deep neural network (DNN), recurrent neural network (RNN), convolutional neural network (CNN), etc., as well as intelligent algorithms applied in the optimization of microsystem SI, including genetic algorithm (GA), differential evolution (DE), deep partition tree Bayesian optimization (DPTBO), two stage Bayesian optimization (TSBO), etc., and compares and discusses the characteristics and application fields of the current applied methods. The future development prospects are also predicted. Finally, the article is summarized.

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Section: Intelligent Optimization Methods For Microsystem Designmentioning

confidence: 99%

Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems

Shan

Wang

et al. 2023

Micromachines

View full text Add to dashboard Cite

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“…Jiang et al 10 proposed a novel compensation technique for bonding wire interconnection based on single‐objective optimization in millimeter wave band using the simulation software. Zhu et al 11 presented a novel vertical wire‐bonding compensation structure, which is modeled and optimized with GRNN and GA methods for system in package. Zhang et al 12 designed a low‐loss interconnection between a radio chip and an antenna using wire‐bonding technique.…”

Section: Introductionmentioning

confidence: 99%

Investigation of impedance compensation in radio frequency circuits with bonding wire

Wang

Gao

Flowers

et al. 2022

Int J RF Mic Comp-Aid Eng

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Bonding wires are extensively used to provide electrical interconnections in communication systems. From the perspective of circuit analysis, the effects of such elements are often treated as an inductance. Bonding wires may cause inductive impedance discontinuity, which negatively impacts signal integrity. In this work, an impedance compensation technique using a chip capacitor was introduced. The electrical performance was improved significantly in the frequency band below 4 GHz. In order to expand the operating frequency of the circuit, another compensation approach based on adding a ground conductor was also studied. This compensation strategy is shown to be effective for frequencies up to 18 GHz. The results obtained from the model simulation for both strategies were also validated experimentally. The model simulation results for both approaches show good agreement with those obtained from the experimental measurements.

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Design and Analysis of Broadband Vertical Via Interconnection Technology for Multilayer Circuit Board of Heart Rate Sensor

Song,

Sun

2023

2023 Cross Strait Radio Science and Wireless Technology Conference (CSRSWTC)

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A Novel Vertical Wire-Bonding Compensation Structure Adaptively Modeled and Optimized With GRNN and GA Methods for System in Package

Cited by 12 publications

References 24 publications

Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems

Application and Prospect of Artificial Intelligence Methods in Signal Integrity Prediction and Optimization of Microsystems

Investigation of impedance compensation in radio frequency circuits with bonding wire

Design and Analysis of Broadband Vertical Via Interconnection Technology for Multilayer Circuit Board of Heart Rate Sensor

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