2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) 2020
DOI: 10.1109/eptc50525.2020.9315066
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A Packaging Solution to Enable Moisture Sensitivity Level 1 Zero Delamination for Leaded Surface Mount Device Package

Zhiwen Li1,
Shu Ming Yip2,
Yee Wai Fung3
et al.
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Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device after Moisture Sensitivity Level 1

Li1,
Yip2,
Fung3
et al. 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Die Attach Material Optimization for Enhancing Package Integrity of Surface Mount Device after Moisture Sensitivity Level 1

Li1,
Yip2,
Fung3
et al. 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Enabling Zero Delamination between Lead Frame Surface and Epoxy Molding Compound at Zero-hour and MSL1 in Leaded Package

Lan,
Leung,
Li
et al. 2023
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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