A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications

Lingamneni, Srilakshmi; Asheghi, Mehdi; Goodson, Kenneth E.

doi:10.1109/itherm.2014.6892372

Cited by 8 publications

(6 citation statements)

References 10 publications

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“…The use of very thin layers of PCM minimizes the solidification time while also meeting geometric constraints. For example, a PCM based heat spreader was fabricated from electro-deposition of metal over a template of spherical microcapsules (<100 μm in diameter) containing PCMs [19]. The authors refer to this as a microporous metal matrix (MMM)-PCM composites.…”

Section: Thermal Management Of Electronicsmentioning

confidence: 99%

Energy Storage Applications

Fleischer

2015

Thermal Energy Storage Using Phase Change Materials

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As discussed in Chap. 1, energy storage through solid-liquid phase change is inherently a transient process and is best suited for systems that experience repeated transients, such as on-off or periodic peaking cycles, or for those systems which require thermal energy storage for later use. PCMs are commonly used in applications for both thermal management and for thermal energy storage.Interest in PCMs for thermal management of systems can be traced back at least through the 1970s. NASA in particular was interested in the use of PCMs as what were then referred to as "thermal capacitors" and PCMs were implemented in several moon vehicles and in Skylab [1]. The 1977 NASA tech brief "A Design Handbook for Phase Change Thermal Control and Energy Storage Devices" [2] was one of the first comprehensive PCM references, and is still widely cited and used today.During the 1970s and 1980s, interest was also building in the application of PCMs in solar systems [3-5] for thermal energy storage in both large solar plants, and in smaller domestic applications such as domestic hot water systems. The concept of embedding PCMs in various types of building materials, such as wallboard and floorboards, in order to create houses and offices with lower heating and cooling loads for greater energy efficiency, also began in the 1970s/80s [6,7]. Simultaneously, a significant amount of fundamental research was being completed on PCMs, considering in-depth the melting and solidification processes, and the roles of conduction and natural convection on the phase change processes [8][9][10][11].With the growth of computing power through the 1980s and 1990s, integrated circuits began dissipating significant amounts of heat and PCM applications in the thermal management of high performance, military and consumer electronics came on the scene in the late 1990s [12][13][14]. More recently, PCMs have seen application in textile design for energy absorbing clothing for military and consumer products [15].

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Section: Thermal Management Of Electronicsmentioning

confidence: 99%

Energy Storage Applications

Fleischer

2015

Thermal Energy Storage Using Phase Change Materials

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“…Recent studies explore the benefits of using PCM as a heat spreader or heat sink enhancer [8] [9][10] [11] [12]. Tan et al use computational fluid dynamics (CFD) simulations for thermal analysis of a mobile phone with a PCM filled heat storage unit [9].…”

Section: Related Workmentioning

confidence: 99%

“…Low conductivity of PCM significantly limits its potential benefits. Using metal matrix-PCM composites as heat spreaders in mobile electronic devices addresses this issue [12].…”

Section: Related Workmentioning

confidence: 99%

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Kaplan

Coskun

2015

2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED)

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CMOS scaling trends lead to elevated on-chip temperatures, which substantially limit the performance of to day's processors. To improve thermal efficiency, Phase Change Materials (PCMs) have recently been used as passive cooling solutions. PCMs store large amount of heat at near-constant temperature during phase change, allowing strategies such as computational sprinting. While existing sprinting methods al low short performance boosts, there is significant unexplored potential in improving performance on systems with PCM enhanced cooling. To this end, this paper proposes a novel run time management policy driven by observations that are not captured by prior techniques: (i) PCM melts non-uniformly due to spatially heterogeneous on-chip heat distribution; (ii) power consumption during sprinting is highly application dependent and assuming a fixed sprinting power leads to lower thermal efficiency; (iii) if we monitor the remaining PCM energy at various locations, we can utilize the PCM heat storage capability much more efficiently. Theproposed Adaptive Sprinting policy exploits these observations to extend sprinting duration for increased performance gains. Our policy monitors the remaining PCM energy corresponding to each core at run time, and using this information, it decides on the number, the location and the voltage-frequency (V If) setting of the sprinting cores. Experimental evaluation including a detailed phase change thermal model demonstrates 29% performance im provement, 22% energy savings, and 43% energy delay product (EDP) reduction on average, compared to prior strategies.

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“…The first group of work focuses on designing more efficient heat spreader or heat sink units by incorporating PCM in the cooling package [7][8][9][10][11]. Tan et al show the benefit of PCM by performing CFD simulations on a mobile phone with a PCM filled heat storage unit [8].…”

Section: Related Workmentioning

confidence: 99%

“…Low thermal conductivity of the PCM is a major limiter on its benefits. Recent work addresses this problem by proposing the use of metal-PCM composites as heat spreaders in mobile devices [11]. In this work, authors show the tradeoff between thermal conductivity and latent heat capacity by performing a parametric analysis on the metal fraction of the composite.…”

Section: Related Workmentioning

confidence: 99%

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Vivero

Kaplan

Coskun

2015

Volume 1: Thermal Management

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Continued CMOS scaling accompanied with a stall in the voltage scaling has led to high on-chip power densities. High on-chip power densities elevate the temperatures, substantially limiting the performance and reliability of computing systems. The use of Phase Change Materials (PCMs)1 has been explored as a passive cooling method to manage excessive chip temperatures. The thermal properties of PCMs allow a large amount of heat to be stored at near-constant temperature during the phase transition. This heat storage capability of PCM can be leveraged during periods of intense computation. For systems with PCM, development of new management strategies is essential to maximize the benefits of PCM. In order to design and evaluate these management strategies, it is necessary to have an accurate PCM thermal model. In our recent work, we proposed a detailed phase change thermal model, which we integrated into a compact thermal simulation tool, HotSpot. In this paper, we build a hardware testbed incorporating a PCM unit on top of the chip package. We then validate the accuracy of our previously proposed thermal model by comparing the HotSpot simulation results against the measurements on the testbed. We observe that the error between the measured and simulated temperatures is less than 4°C with 0.65 probability. Finally, we implement a soft PCM capacity sensor that monitors the remaining PCM latent heat capacity to be used for development of thermal management policies. We evaluate a set of thermal management policies on the testbed. We compare policies that adjust the sprinting frequency based on current temperature against the policies that take action based on the remaining PCM capacity.

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A parametric study of Microporous Metal Matrix-Phase Change Material composite heat spreaders for transient thermal applications

Cited by 8 publications

References 10 publications

Energy Storage Applications

Energy Storage Applications

Adaptive sprinting: How to get the most out of Phase Change based passive cooling

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

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