A PCB based package and 3D assembly for high power density converters

Mrad, Roberto; Morand, Julien; Perrin, Rémi; Mollov, Stefan

doi:10.1109/iwipp.2019.8799099

Cited by 7 publications

(4 citation statements)

References 3 publications

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“…Mitsubishi Electric R&D Center Europe (MERCE) introduces a design where the switches are directly embedded into a PCB section called power stage and are closely integrated with gate driver ICs, a ceramic capacitor, and an inductor section. It can achieve a fast switching of 58kV/µS without ringing [90]. This module is a typical example of integrating multiple electronic components into one package in addition to the gate driver ICs.…”

Section: A System Integrationmentioning

confidence: 99%

“…For high power PCBs, thicker copper layers up to 1 mm are required. In [90], four thin copper layers connect the die pads, four thick copper layers conduct large currents and spread excessive heat. Laser drilled micro-vias are utilized to connect vertically stacked SiC chips, while copper layers are connected through larger vias.…”

Section: B Pcb Embedded Technologymentioning

confidence: 99%

“…In this way, different packaging technologies can easily be combined and compensate for each other's limitations to better meet the requirements of future automotive applications. For example, in [90] and [102], the designs have the features of both a 3D package and a PCB embedded package. While in [90], the module integrated the gate driver and other components.…”

Section: High Complexity 3d Packagingmentioning

confidence: 99%

“…For example, in [90] and [102], the designs have the features of both a 3D package and a PCB embedded package. While in [90], the module integrated the gate driver and other components. Most of the press-pack modules can also be classified as the 3D packaging, such as the examples in Fig.26 and Fig.27.…”

Section: High Complexity 3d Packagingmentioning

confidence: 99%

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Automotive Power Module Packaging: Current Status and Future Trends

et al. 2020

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Semiconductor power modules are core components of power electronics in electrified vehicles. Packaging technology often has a critical impact on module performance and reliability. This paper presents a comprehensive review of the automotive power module packaging technologies. The first part of this paper discusses the driving factors of packaging technology development. In the second section, the design considerations and a primary design process of module packaging are summarized. Besides, major packaging components, such as semiconductor dies, substrates, and die bonding, are introduced based on the conventional packaging structure. Next, technical details and innovative features of state-of-the-art automotive power modules from major suppliers and original equipment manufacturers are reviewed. Most of these modules have been applied in commercial vehicles. In the fourth part, the system integration concept, printed circuit board embedded packaging, three-dimensional packaging, press pack packaging, and advanced materials are categorized as promising trends for automotive applications. The advantages and drawbacks of these trends are discussed, and it is concluded that a preferable overall performance could be achieved by combining multiple technologies. INDEX TERMS Electric vehicles, power electronics, semiconductor device packaging TABLE I PRIMARY DESIGN CONSIDERATIONS OF MODULE PACKAGING Design considerations Details Size Volume, weight, power density, energy density. Electrical performance Current rating, voltage rating, switching frequency range, power loss, electrical insulation, electromagnetic interference (EMI). Thermal management Temperature distribution, thermal resistance (Rth), heat capacity, coefficient of thermal expansion (CTE). Mechanical strength Thermal stress distribution, material properties (Tensile strength, flexural strength, peel strength, etc.), external shock and vibration. Reliability and fatigue Joints failure, crack propagation, delamination, lifetime under temperature and power cycling. Manufacturability and assembly Manufacture procedure, process temperature and pressure, external connections.

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Section: A System Integrationmentioning

confidence: 99%

Section: B Pcb Embedded Technologymentioning

confidence: 99%