A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Abstract

A multilayer planar interconnection structure was used for the packaging of liquid-cooled automotive power modules. The power semiconductor switch dies are sandwiched between two symmetric substrates, providing planar electrical interconnections and insulation. Two minicoolers are directly bonded to the outside of these substrates, allowing doublesided, integrated cooling. The power switch dies are orientated in a face-up/face-down 3-D interconnection configuration to form a phase leg. The bonding areas between the dies and substrates, and the substrates and coolers are designed to use identical materials and are formed in one heating process. A special packaging process has been developed so that high-efficiency production can be implemented. Incorporating high-efficiency cooling and low-loss electrical interconnections allows dramatic improvements in systems' cost, and electrical conversion efficiency. These features are demonstrated in a planar bond-packaged prototype of a 200 A/1200 V phase-leg power module made of silicon (Si) insulated gate bipolar transistor and PiN diodes.

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

“…Considering a bare die SiC switch from CREE company (Durham, NC) [21] with dimensions of 4 mm  6 mm, the heat flux was computed to be within 80-105 W/cm 2 . For most applications, this magnitude of heat flux is high enough to require significant heat spreading, usually via heat pipes and large heat sinks, or more advanced methods such as liquid cooling [22][23][24][25][26][27][28]. However, the air cooled VEMMS is, by design, capable of handling such heat fluxes, ensuring that the switches operate below their maximum recommended temperature of $200 C [21].…”

Review of Packaging Schemes for Power Module

“…Liang et al [23] proposed a multilayer planar interconnection package structure for a 200-A/1200-V IGBT phase-leg power module, as shown in Fig. 6.…”

Power module stray inductance extraction: Theoretical and experimental analysis

“…Various technologies have been proposed to reduce the stray inductance of a power module, including special layouts for chip positioning on a ceramic substrate layout [3,4,7,8], three-dimensional (3D) vertical structures with planar bonds, and double-side cooling [9,10], wide area bonding using flexible circuit boards, and silver diffusion sintering joints [11,12].…”