A photosensitive-BCB on laminate technology (MCM-LD)

Strandjord, Andrew; Heistand, R.; Bremmer, J. N.; Garrou, Philip E.; Tessier, T.G.

doi:10.1109/ectc.1994.367561

Cited by 11 publications

(4 citation statements)

References 23 publications

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“…The MCM‐L technology also has three layers, but the module area is twice that of the base case. This assumption is based on the factor of two line width difference between laminate and thin film technology, as reported for the MCM‐D and MCM‐L technologies 1. Lastly, using only MCM‐D technology allows two layers of signal according to the assumptions of MCM design in this paper.…”

Section: Methodsmentioning

confidence: 89%

“…Technical Cost Modelling is an appropriate tool that can illuminate the cost issues of numerous MCM technologies, and can therefore aid decision makers and technology developers. As an example, this methodology is applied to the MCM‐D/L technology that is in development with Dow Chemical1 and is somewhat similar to what is being done by others 2…”

Section: Introductionmentioning

confidence: 99%

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A Cost Comparison of New MCM Technologies

Singer

1996

Circuit World

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In the course of technology development, decisions must be made about the nature of future progress. To aid in this decision‐making process, Technical Cost Modelling has evolved from traditional cost modelling methodologies in order to accurately predict the dynamics of a system of manufacture. As an example of the utility of this methodology, a new MCM technology has been chosen for cost analysis: deposited dielectric on laminate (MCM‐D/L) electronic packages. For this illustration, the cost drivers are determined and cost/performance trade‐offs with MCM‐D and MCM‐L analysed. With this disciplined approach to cost prediction, technology development cost issues can be decided thoroughly yet fairly quickly.

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Section: Methodsmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 99%

A Cost Comparison of New MCM Technologies

Singer

1996

Circuit World

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“…MCM is one of the important steps of 3-dimentional High Density Packaging (3D HDP). It draws attentions and intensive investments in recent years because it offers a promising solution for product miniaturization and outstanding package performance [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Tang

Wang

Xiao

et al. 2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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This paper presents a wafer-level microwave multichip module (MMCM) packaging process for 24GHz driver amplifier using photosensitive-Benzocyclobutene (photo-BCB) of 25μm. It is developed for multilayer interconnection of monolithic microwave integrated chip (MMIC). A 24GHz driver amplifier chip is embedded in a wet-etched trench on 4 inch lossy Si wafer and covered with a layer of BCB as dielectrics. Microstrip lines are fabricated with two layers of metal patterns to connect pads on MMIC with the test pads on MCM package in case of excessive loss. The interlayer connection resistance of this metal/BCB interconnection structure is tested with interconnection chain structures through Kelvin resistance measurement. The electrical characteristics of the package are also illustrated. The gain of the amplifier (S 21 ) after packaging is more than 22dB from 21GHz to 26 GHz, and the S 21 changes when packaged is less than 2 dB. The return loss S 11 and S 22 is less than -14.1dB and -17.3dB from 21GHz to 26GHz.

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“…Bisbenzocyclobutene (BCB) has been widely used for redistribution layers because of its low dielectric constant and dissipation factor [2,3,4]. Dow Chemical Corporation produces a BCB photosensitive material called Cyclotene™ that contains a divinyl siloxane structure [5].…”

mentioning

confidence: 99%

Characterization of a novel photoresist redistribution material for advanced packaging applications

Flack¹,

Nguyen²,

Capsuto³

2002

SPIE Proceedings

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The widespread adoption of advanced packaging techniques is primarily driven by electrical device performance and chip form factor considerations. Flip chip packaging is currently growing at a 27% compound annual rate and it is expected that by 2005 over 60% of all 300 mm wafers will be bumped [1]. To ensure optimal productivity and cost of ownership it is imperative to provide lithographic materials that are optimized for these applications.Flip chip packaging frequently uses one or more redistribution levels to increase the number of pads that can be bumped in the minimum form factor. The redistribution level requires a photosensitive dielectric material to be used as a permanent insulating layer. The mechanical, electrical and lithographic properties of the material for this level are all important. This study will characterize a novel photosensitive siloxane material (Shin-Etsu SINR™ Photoresist) for the use in the redistribution layer. Siloxanes are a good choice for redistribution because of their excellent physical properties, ease of processing and relatively low curing temperatures.The lithographic performance of SINR photoresist has been optimized using a broad band 1X stepper to control critical dimensions (CD). This study evaluates process capability at multiple exposure wavelengths and post exposure bake (PEB) conditions. Cross sectional SEM analysis, process linearity, Bossung plots and process windows are used to establish the lithographic capabilities. Material modifications also were investigated to control the photoresist sidewall angles.

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A photosensitive-BCB on laminate technology (MCM-LD)

Cited by 11 publications

References 23 publications

A Cost Comparison of New MCM Technologies

A Cost Comparison of New MCM Technologies

An MCM package process for 24GHz driver amplifier using photosensitive BCB

Characterization of a novel photoresist redistribution material for advanced packaging applications

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