2011
DOI: 10.1063/1.3580588
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A poly(vinylidene fluoride) composite with added self-passivated microaluminum and nanoaluminum particles for enhanced thermal conductivity

Abstract: A polymer composite was prepared by embedding fillers made of self-passivated aluminum particles in two kind of sizes, micrometer size and nanometer size with different volume proportions into polyvinylidene fluoride matrix. The thermal conductivity and dielectric properties of the composite were studied. The results showed that the thermal conductivity of composites was significantly increased to 3.258 W∕mK when the volume proportion of micrometer size Al particles to nanometer size Al particles is at 20:1, a… Show more

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Cited by 64 publications
(45 citation statements)
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“…To further analyze and elucidate the effective thermal conductivities of sandwiched composites, several equations incorporating theoretical and empirical models have been developed [29][30][31][32][33][34]. In this study, we applied the modified series conduction model to calculate the thermal conductivity of sandwiched composites and compared it with our experimental data.…”
Section: Resultsmentioning
confidence: 97%
“…To further analyze and elucidate the effective thermal conductivities of sandwiched composites, several equations incorporating theoretical and empirical models have been developed [29][30][31][32][33][34]. In this study, we applied the modified series conduction model to calculate the thermal conductivity of sandwiched composites and compared it with our experimental data.…”
Section: Resultsmentioning
confidence: 97%
“…Recently, the surface self-passivated micro or nanometer aluminum particles (Al) was chosen to fabricate the core-shell structured Al (Al@Al 2 O 3 )/polymer composites with an improved thermal conductivity and relatively high permittivity but low dielectric loss [2,17,23,[31][32][33][34]. However, there is much room for improvement in the dielectric constant and thermal conductivity of the composites.…”
Section: Introductionmentioning
confidence: 98%
“…Recently, the conductor-insulator core-shell structured particle has been employed to prepare polymeric composites with high dielectric constant and low loss. The metal core is used to increase the dielectric constant due to the interfacial polarization (namely, MWS effect), and the insulator shell serves as a barrier layer to control the dielectric loss efficiently through blocking the electron transfer between adjacent metal cores [2,17,23,[31][32][33][34]. Additionally, it is essentially crucial for the heat generated from electronics to be dissipated as quickly and effectively as possible, to maintain the operating temperatures of the electronic equipment at a desired level because the dielectric strength will decrease with increasing temperature owing to a poor thermal conduction of these dielectric materials [35,36].…”
Section: Introductionmentioning
confidence: 99%
“…[1,2] These electronic packing materials must possess low dielectric constant and low dielectric loss to reduce the signal distortion, which in turn provides better equipment performance. Meanwhile, the materials also have superior thermal transport properties to dissipate the waste heat and low matching thermal expansion coefficient with substrate.…”
Section: Introductionmentioning
confidence: 99%