A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connections

An, Dong; Cheng, Shuaishuai; Zhang, Zhiyi; Jiang, Can; Fang, Haoming; Li, Jiaxiong; Liu, Yaqing; Wong, Ching‐Ping

doi:10.1016/j.carbon.2019.08.072

Cited by 114 publications

(34 citation statements)

References 48 publications

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“…The thermal conductivity of solid material is mainly determined by the thermal conduction of phonons (energy quanta of lattice vibrations) and free electrons [ 11 ]. For polymers, regarded as thermal insulators, the thermal conductivity of polymers is dominated by the contribution of phonons, while in metals, the contribution from electrons is much greater than that of phonons [ 5 , 12 ]. According to Debye’s assumptions, the thermal conductivity ( K ) of polymers could be expressed as Equation (1):

where C p is the specific heat capacity per unit volume, ν is the phonon velocity and l represents the phonon mean free path.…”

Section: Intrinsic Thermally Conductive Polymersmentioning

confidence: 99%

“…As a result, the thermal conductivity of PDA@BN/PVA composites is higher than that of pristine BN composites; when the content of BN is 30 vol%, the thermal conductivity of PDA@BN/PVA composite is as high as 8.8 Wm −1 K −1 . Similarly, An et al [ 5 ] constructed a 3D network of BN/reduced graphene oxide (BN/rGO) covalent bonding through surface modification and ice-templating self-assembly, which can significantly reduce the interfacial thermal resistances caused by polymer-filler and filler-filler interfaces. The BN/rGO/nature rubber (BN/rGO/NR) composite exhibits a high through-plane thermal conductivity of 1.28 Wm −1 K −1 with the filler loading of only 4.9 vol%.…”

Section: Thermally Conductive Polymer Compositesmentioning

confidence: 99%

“…Polymers have superior mechanical properties, electrical insulation, chemical resistance, light weight, and excellent processability [ 4 ], which play an important role in the fields of electronic devices, aerospace, transportation, etc. The polymer-based thermal management material has therefore aroused great interest in researchers [ 5 ].…”

Section: Introductionmentioning

confidence: 99%

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Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Zhang

Shi

2021

Polymers

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The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

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where C p is the specific heat capacity per unit volume, ν is the phonon velocity and l represents the phonon mean free path.…”

Section: Intrinsic Thermally Conductive Polymersmentioning

confidence: 99%

Section: Thermally Conductive Polymer Compositesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Zhang

Shi

2021

Polymers

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“…This pristine pellet form of EPDM was composed of ethylene (69%) and a bicyclic monomer ethylidene norbornene (4.2%). Boron nitride (BN) thermally-conductive nanoparticles [25] with a size of 50 nm and a density of 2250 kg/m 3 were supplied by Beijing DK Nano Technology, Beijing, China. The surface of the nanoparticle was functionalized by KH570 silane coupling to reduce the degree of agglomeration in the composites.…”

Section: Nanocomposites Fabricationmentioning

confidence: 99%

Simulation and Experimental Investigation on Carbonized Tracking Failure of EPDM/BN-Based Electrical Insulation

et al. 2020

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Ethylene propylene diene monomer (EPDM) is broadly employed as an insulating material for high voltage applications. Surface discharge-induced thermal depolymerization and carbon tracking adversely affect its performance. This work reports the electrical field modeling, carbon tracking lifetime, infrared thermal distribution, and leakage current development on EPDM-based insulation with the addition of nano-BN (boron nitride) contents. Melt mixing and compression molding techniques were used for the fabrication of nanocomposites. An electrical tracking resistance test was carried out as per IEC-60587. Simulation results show that contamination significantly distorted the electrical field distribution and induced dry band arcing. Experimental results indicate that electric field stress was noticed significantly higher at the intersection of insulation and edges of the area of contamination. Moreover, the field substantially intensified with the increasing voltage levels. Experimental results show improved carbonized tracking lifetime with the addition of nano-BN contents. Furthermore, surface temperature was reduced in the critical contamination flow path. The third harmonic component in the leakage current declined with the increase of the nano-BN contents. It is concluded that addition of nano-BN imparts a better tracking failure time, and this is attributed to better thermal conductivity and thermal stability, as well as an improved shielding effect to electrical discharges on the surface of nanocomposite insulators.

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“…Boron nitride (BN) has attracted much attention as a thermally conductive filler material due to its electrical insulation, high thermal conductivity, and physicochemical stability [ 10 , 11 , 12 , 13 , 14 ]. The spherical shape of the BN particles promotes high packing densities and filler connectivities compared to other particles.…”

Section: Introductionmentioning

confidence: 99%

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Lee

Kim

2021

Polymers

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Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

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A polymer-based thermal management material with enhanced thermal conductivity by introducing three-dimensional networks and covalent bond connections

Cited by 114 publications

References 48 publications

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Simulation and Experimental Investigation on Carbonized Tracking Failure of EPDM/BN-Based Electrical Insulation

Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

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