Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

Abstract

The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

Effect of magnetic field treatment on effective thermal conductivity for polyimide‐based composite sheet using magnetite‐decorated hexagonal boron nitride

“…Among these, ceramics have shown electrical insulation properties. Therefore, the polymer‐based composite materials including ceramics can maintain insulation performance to some extent 6,7 …”

“…Therefore, the polymer-based composite materials including ceramics can maintain insulation performance to some extent. 6,7 Many types of ceramics have been used to enhance the k of polymer-based composites. Hexagonal boron nitride (hBN) is one of the most common ceramic fillers used to increase k. [8][9][10] Hexagonal boron nitride has a large amount of anisotropic k and the k in the in-plane direction (a-axis, [100]) has reached values as high as 600 W/(m K).…”

Organic–Inorganic Double-Gel System Thermally Insulating and Hydrophobic Polyimide Aerogel

“…The overconsumption of energy is becoming a critical issue, based on engineering, environmental, and economic challenges in modern industries [ 1 , 2 , 3 ]. Pursuing a novel material with high performance and energy efficiency is a forefront research topic in terms of industrial applications [ 4 , 5 , 6 , 7 ]. Aerogel, as an impressive commercial energy material, plays a crucial role in the thermal insulation field due to its high strength and low density, which can be subdivided into inorganic and organic aerogels.…”

A Novel Branched Al2O3/Silicon Rubber Composite with Improved Thermal Conductivity and Excellent Electrical Insulation Performance

“…In recent years, the introduction of fillers with high thermal conductivity into polymer matrix to prepare polymer composites has attracted a considerable amount of attention, and it has been confirmed that this is an effective way to enhance the thermal conductive property of polymer matrices in academia and industry [7,8]. Traditional thermal conductive fillers used to prepare high thermal conductivity polymer composites include metal fillers (Al and Cu), carbon-based materials (graphene and carbon nanotubes) and ceramic fillers (AlN, BN, Al2O3 and SiC) [9][10][11]. Unfortunately, the addition of metal fillers or carbon-based fillers tends to damage the insulation property of the material to a certain extent, while ceramic fillers show unquestionable advantages due to their high thermal conductivity and electrical resistivity [12].…”