A potential pH diagram for the system Cu-NH3-Cl−-H2O

Bartoníček, R.; Lukasovská, M.

doi:10.1016/s0010-938x(69)80065-x

Cited by 19 publications

(6 citation statements)

References 7 publications

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“…The effect of potential and pH on anodic inhibition by benzotriazole is investigated, together with time-dependent effects and factors governing the stability of reaction films. The study required construction of new E-pH diagrams for the Cu-CI--H20 system, because earlier diagrams were based on chloride activities that either were significantly lower than the present study (30), contained other complexing ligands such as NH~ and NH3 (31,32), or did not include the effect of CuCI~ complexes (33).…”

mentioning

confidence: 96%

“…However, despite the numerous benazotriazole inhibitor studies in chloride solutions (4,6,(9)(10)(11)(12)(17)(18)(19)(20)(21)(22), only a few workers (8,13,14) have explicitly recognized the formation of CuCI~ complexes, even though they are reported to control the anodic dissolution kinetics of copper in inhibitor-free solutions (1-3). Furthermore, although a few theoretical potential-pH diagrams of aqueous equilibria involving copper and chlorides have appeared in the literature (30)(31)(32)(33), no studies have been reported that use the thermodynamics of Cu-CI--H20 equilibria as a basis for establishing whether inhibitor interactions may be occurring on oxide-free or oxide-covered surfaces.…”

mentioning

confidence: 99%

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Anodic Polarization Behavior of Copper in Aqueous Chloride/Benzotriazole Solutions

Tromans¹,

Sun²

1991

J. Electrochem. Soc.

291

172

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Potential‐pH equilibria and potentiodynamic polarization studies were used to confirm that formation of CuCl2− complexes in 1.0M normalNaCl and 0.1M normalNaCl solutions produces a range of potentials at which anodic dissolution of copper occurs without formation of oxide. The interaction of benzotriazole (1 g/l) with oxide‐free copper surfaces in the chloride solutions was studied by potentiodynamic polarization and potentiostatic techniques. Inhibition of the anodic dissolution reaction was obtained in near‐neutral pH solutions and at pH 3.0. Inhibition was ineffective at pH 1.0. The interaction of benzotriazole with oxide‐free surfaces, leading to inhibition, was potential‐ and time‐dependent. Also, a limiting potential was observed and predicted above which additions of benzotriazole are ineffective and above which existing inhibiting films cannot undergo spontaneous repair. The results confirm that benzotriazole can interact with oxide‐free surfaces to promote corrosion inhibition of copper. The characteristics of the inhibition behavior, including breakdown and pH effects, were consistent with an inhibiting film that formed by adsorption of neutral benzotriazole molecules onto the Cu surface, followed by the adsorption of a thin layer of cuprous benzotriazole in polymeric form.

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confidence: 96%

mentioning

confidence: 99%

Anodic Polarization Behavior of Copper in Aqueous Chloride/Benzotriazole Solutions

Tromans¹,

Sun²

1991

J. Electrochem. Soc.

291

172

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“…The treatment involved soaking the corroded float in pH 9.6 buffer solutions of 0.25 M NH 3 The low viscosity and surface tension of ammonia in aqueous solutions facilitates the extraction of chlorides from pits and adsorption of SO 4 2− ions from the wash solutions actively assists in the hydrolysis of aluminum corrosion products. Ammonia readily reacts with copper (II) corrosion products to form stable Cu(NH 3 ) 4 2+ complexes which are no longer available for cementation reactions (Bartonicek and Lukasovska, 1969;Lowson 1974). The addition of ammonia fundamentally changes the thermodynamic stability of the re-deposited copper and allows it to be slowly leached from the surface through reaction with the dissolved oxygen present in the open fiberglass lined concrete tank.…”

Section: Ammonia Leaching Of Cemented Copper From Duralumin Alloysmentioning

confidence: 99%

Aluminum: History, Technology, and Conservation

2019

Smithsonian Contributions to Museum Conservation

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The current volume brings together papers presented at the 2014 “Aluminum: History, Technology and Conservation” conference held at the Smithsonian Institution’s American Art Museum; the conference was followed by a hands-on workshop held at the National Air and Space Museum’s Steven F. Udvar-Hazy Center, which utilized the museum’s collections to illustrate aluminum’s use, conservation challenges, and repair techniques as well as to introduce participants to analytical techniques such as X-ray fluorescence for the identification of aluminum alloys and finishes. The three day international conference and two-day workshop were co-hosted with the Smithsonian Institution, the Foundation for the American Institute for Conservation and the International Council of Museums Committee for Conservation Metals Working Group. An unprecedented group of speakers, organizers, and sponsors made possible the first ever conservation conference solely dedicated to aluminum. The conference featured presentations by twenty-seven speakers from Europe, Asia, Australia, and North America who explored various aspects of degradation phenomena and conservation strategies for aluminum objects, from sculpture to aircraft, from nineteenth-century jewelry to underwater archaeological objects. The proceedings are divided into eight categories and represent the various themed sessions: the history and manufacturing of aluminum, corrosion and deterioration, characterization and identification, conservation of archaeological objects, conservation and use in contemporary art, conservation of architectural elements, surface treatments and inhibition, and preventative conservation.

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“…It passivates the metal with an elevation of its electrode potential and gradually traps the hydrochloric acid into the forming cavity. This leads to the formation 11 M) (91) In such a solution, the reaction of dissolving copper, Cu ~ Cu…”

Section: Localized Corrosion Of Copper In Presence Of Watermentioning

confidence: 99%

Thermodynamics of Corrosion

Muylder

1981

Electrochemical Materials Science

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A potential pH diagram for the system Cu-NH3-Cl−-H2O

Cited by 19 publications

References 7 publications

Anodic Polarization Behavior of Copper in Aqueous Chloride/Benzotriazole Solutions

Anodic Polarization Behavior of Copper in Aqueous Chloride/Benzotriazole Solutions

Aluminum: History, Technology, and Conservation

Thermodynamics of Corrosion

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