A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

Chunpeng, Chu; Jiang, Bingyan; Zhu, Laiyu; Jiang, Fengze

doi:10.1515/polyeng-2013-0092

Cited by 11 publications

(8 citation statements)

References 16 publications

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“…In our previous studies, it was demonstrated that the microchannel decreased linearly in height and width as the bonding pressure increased. The maximum deformation in microchannel height reached 14.375%, with a bonding pressure of 3 MPa and a bonding temperature close to the T g point [13,26].…”

Section: Resultsmentioning

confidence: 99%

“…Following the injection molding process, the chip must be joined together to make sure it is firmly bonded and that there is no sign of leakage during the usage [10,11,12]. Thermal bonding of polymer chips is the most commonly used approach, because it allows the formation of microchannels with a uniform surface [13]. The proper control of bonding parameters such as bonding pressure and bonding temperature is critical to achieving a strong bond, while limiting the deformation of the microchannels on the substrate surface.…”

Section: Introductionmentioning

confidence: 99%

“…In conventional thermal bonding experiments, bonding temperature is recommended to be near the glass transition temperature ( T g ) in order to achieve a good bonding. Bonding temperatures significantly higher than T g cannot be applied in the thermal bonding process, as they would easily melt the microchannel pattern on substrate [13,14]. However, to date, the bonding mechanism of polymer is still under debate, even though molecule diffusion or adsorption theory can explain certain phenomena in polymer bonding with valid causes.…”

Section: Introductionmentioning

confidence: 99%

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Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

et al. 2019

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Thermal bonding technology is the most commonly used approach in bonding injection-molded microfluidic chips. Although the bonding mechanism is still under debate, the molecular dynamics (MD) method can provide insight into the bonding process on a macromolecular level. In this study, MD simulations for thermal bonding of PMMA substrate and cover sheet were performed. The molecule configuration and density distribution during the thermal bonding process were studied. The effects of bonding pressure on the equivalent strain, joining energy and diffusion coefficient were investigated. The debonding process was simulated to analyze the bonding strength and failure mechanism. Simulation results show that penetration mainly takes place near the interface area. Although the final density increases slightly with increasing pressure, the bonding interface is still insufficiently filled. The equivalent strain grows faster than that in the later stage because of the gap at the interface. The bonding pressure shows clear effects on the joining energy, diffusion coefficient and stress–strain behavior. Tensile failure occurs at the interface, with PMMA chains stretched between two layers. The majority of the change in potential energy is correlated with the change in non-bonded energy. At yield strain, the low-density defect at the interface weakens the tensile strength of bonded chip.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

et al. 2019

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“…Custom devices were built so as to perform thermal bonding in line with injection moulding, so as to save processing time and thermal energy. This method is fast and reliable, but requires a custom device and only allows the bonding of two layers, thus significantly limiting chip design (Chu et al 2015). Using layers of a lower T g polymer, such as TMMF (photosensitive epoxy laminate) for the thermal welding of PMMA, reduces deformation on the PMMA bulk, although the procedure is time-consuming and requires photolithography equipment for the shaping of TMMF (Kalkandjiev et al 2010).…”

Section: Introductionmentioning

confidence: 99%

Safe and cost-effective rapid-prototyping of multilayer PMMA microfluidic devices

Liga

Morton

Kersaudy-Kerhoas

2016

Microfluid Nanofluid

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“…In recent years, micro/nanostructured products have been applied and developed in many fields, such as biomedical, aerospace, clean energy, and electronic communication [1,2,3,4]. Micro-injection molding technology, due to its low cost and high efficiency, is regarded as one of the most promising manufacturing methods for micro/nanostructures.…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

et al. 2019

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In micro-injection molding, the interaction between the polymer and the mold insert has an important effect on demolding quality of nanostructure. An all-atom molecular dynamics simulation method was performed to study the effect of nanostructure shape, interfacial adhesion energy, and mold insert material on demolding quality of nanostructures. The deformation behaviors of nanostructures were analyzed by calculating the non-bonded interaction energies, the density distributions, the radii of gyration, the potential energies, and the snapshots of the demolding stage. The nanostructure shape had a direct impact on demolding quality. When the contact areas were the same, the nanostructure shape did not affect the non-bonded interaction energy at PP-Ni interface. During the demolding process, the radii of gyration of molecular chains were greatly increased, and the overall density was decreased significantly. After assuming that the mold insert surface was coated with an anti-stick coating, the surface burrs, the necking, and the stretching of nanostructures were significantly reduced after demolding. The deformation of nanostructures in the Ni and Cu mold inserts were more serious than that of the Al2O3 and Si mold inserts. In general, this study would provide theoretical guidance for the design of nanostructure shape and the selection of mold insert material.

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A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

Cited by 11 publications

References 16 publications

Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

Safe and cost-effective rapid-prototyping of multilayer PMMA microfluidic devices

Molecular Dynamics Simulation on the Influences of Nanostructure Shape, Interfacial Adhesion Energy, and Mold Insert Material on the Demolding Process of Micro-Injection Molding

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