2004
DOI: 10.1016/j.sse.2003.12.030
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A process/physics-based compact model for nonclassical CMOS device and circuit design

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Cited by 95 publications
(41 citation statements)
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“…the silicon layer) is undoped or lightly doped, the mobility is constant along the channel and both quantum effects and polydepletion effect are neglected. The last assumption is valid for silicon layer thicknesses down to at least 20 nm: For thinner layers, quantum effects start to play a role [3,7], but might actually be considered as a correction to the classical derivation. The schematic diagram of the DG MOSFET investigated in this work is shown in Figure 1.…”
Section: Implicit Modelmentioning
confidence: 99%
“…the silicon layer) is undoped or lightly doped, the mobility is constant along the channel and both quantum effects and polydepletion effect are neglected. The last assumption is valid for silicon layer thicknesses down to at least 20 nm: For thinner layers, quantum effects start to play a role [3,7], but might actually be considered as a correction to the classical derivation. The schematic diagram of the DG MOSFET investigated in this work is shown in Figure 1.…”
Section: Implicit Modelmentioning
confidence: 99%
“…4(b) shows the I DS vs. V GS characteristics for the device in Table I predicted using TCAD and the Spice3-UFDG model in FinE. Spice3-UFDG [7] is a physics-based compact model that simulates double-gate devices accurately, and shows excellent agreement with our device simulation in weak as well as strong inversion regions. We have employed device simulations using TCAD in FinE for all subsequent results owing to better convergence behavior in TCAD.…”
Section: Simulation Setupmentioning
confidence: 64%
“…We have developed an environment called FinE (Fig. 3), which integrates Sentaurus TCAD [6] and the Spice3-UFDG [7] model into a single framework, thereby enabling designers to perform high-level experiments with ease. Fig.…”
Section: Simulation Setupmentioning
confidence: 99%
“…Transfer characteristics are presented for various back-gate voltages (V gbs ). The University of Florida double-gate (UFDG) SPICE model [5] was used for 32-nm FinFET simulations. The power supply was fixed at 1 V. Curves corresponding to SG, LP, and IG modes of operation are indicated.…”
Section: Shorted-gate and Independent-gate Finfetsmentioning
confidence: 99%
“…To quantify the delay of the variously oriented transistors, simulations were performed using a double-gate HSPICE model, called BSIM [24], in conjunction with UFDG [5]. source current (I ds ) with drain-to-source voltage (V ds ) for different channel orientations at the 32-nm FinFET technology node.…”
Section: Oriented Finfetsmentioning
confidence: 99%