A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces

Dai, Wen; Lian, Kun; Wang, Wanjun

doi:10.1007/s00542-005-0587-4

Cited by 51 publications

(36 citation statements)

References 20 publications

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“…Hence, the fresh titanium coating has the best adhesion with the SU-8 layer compared to the other coatings or surface treatments. Additionally, the results obtained from our tests are better than the previously published results [7]. Dai et.…”

Section: Resulsupporting

confidence: 61%

“…was 97.71 kPa for a titanium (fresh or oxidized state is unknown) coated silicon substrate followed by 87.72 kPa for a chrome (fresh or oxidized state is unknown) coated substrate. A summary of the adhesion strength data, both our data and that previously reported in [7], is presented in Table 2.…”

Section: Resulmentioning

confidence: 89%

“…Barber et al also investigated adhesion strength of thick (600 μm) SU-8 layers to gold, again with adhesion promoters, and obtained the best adhesion results (0.25N/mm 2 ) again with MPTS [9]. Similarly, Dai et al [7] investigated the adhesion strength of 100 μm SU-8 layers on various metal layers on soda-lime glass, and reported the best adhesion strength on titanium layers, followed by that on chromium layers. However, sufficient quantitative analysis of the adhesion strength was not presented.…”

Section: Introductionmentioning

confidence: 91%

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Effect of surface treatments/coatings and soft bake profile on surface uniformity and adhesion of SU-8 on a glass substrate

et al. 2010

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We present the effect of surface treatments/coatings and soft bake temperatures aimed at improving adhesion and surface uniformity of SU-8 on glass substrates. While the adhesion strength of SU-8 to metal layers on glass and silicon has been previously investigated, our research examines the influence of additional surface treatments (RCA, Acetone/IPA rinse) and coatings (fresh/one-day-aged Ti, fresh/one-day-aged Cr, SU-8 2005®) on adhesion strength as well as surface uniformity for 100 μm thick SU-8 films. Additionally, we vary the soft bake times and temperatures while keeping all other process parameters constant, to correlate adhesion strength with surface uniformity of SU-8 films for each surface modification.We have found that for all surface treatments/coatings, a soft bake temperature of 65 o C for 90 minutes yielded a more uniform SU-8 film (σ = 5.18 μm) as compared to the manufacturer-recommended soft bake temperature of 95 o C (σ = 12.66 μm) for 30 minutes. Consequently, a more uniform SU-8 film provided excellent adhesion strength (> 2 MPa, as determined by stress testing using an Instron® microtester) for both metallic seed layers while the adhesion strength of films baked at 95 o C was determined to be < 0.5 MPa. This study, for the first time, has been able to quantitatively determine the adhesion strength of SU-8 films on different seed layers deposited on glass substrates, for varying soft bake temperatures.

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Section: Resulsupporting

confidence: 61%

Section: Resulmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 91%

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Effect of surface treatments/coatings and soft bake profile on surface uniformity and adhesion of SU-8 on a glass substrate

et al. 2010

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“…A similar strategy has been demonstrated with an epoxy resist using a silane with an amine group at the end [91]. Adhesion of SU-8 on metal surfaces (e.g., used as seed layer for a subsequent metal electrodeposition or as a sacrificial layer) or metal on SU-8 layers (e.g., electrodes for MEMS or microfluidic systems) may also be a problem [92]. Adhesion quality can be improved with oxygen plasma treatment or coating of an ultra-thin titanium adhesion layer.…”

Section: Adhesionmentioning

confidence: 94%

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

et al. 2007

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Since its introduction in the nineties, the negative resist SU-8 has been increasingly used in micro- and nanotechnologies. SU-8 has made the fabrication of high-aspect ratio structures accessible to labs with no high-end facilities such as X-ray lithography systems or deep reactive ion etching systems. These low-cost techniques have been applied not only in the fabrication of metallic parts or molds, but also in numerous other micromachining processes. Its ease of use has made SU-8 to be used in many applications, even when high-aspect ratios are not required. Beyond these pattern transfer applications, SU-8 has been used directly as a structural material for microelectromechanical systems and microfluidics due to its properties such as its excellent chemical resistance or the low Young modulus. In contrast to conventional resists, which are used temporally, SU-8 has been used as a permanent building material to fabricate microcomponents such as cantilevers, membranes, and microchannels. SU-8-based techniques have led to new low-temperature processes suitable for the fabrication of a wide range of objects, from the single component to the complete lab-on-chip. First, this article aims to review the different techniques and provides guidelines to the use of SU-8 as a structural material. Second, practical examples from our respective labs are presented.

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“…LIGA or inductively coupled plasma (ICP) etching technique for silicon based micro systems, which requires expensive equipment. However, despite all of these advantages, there are three disadvantages associated with the SU-8 photoresist: adhesion selectivity (Dai et al 2005), residual stress and resist stripping. In many cases, the wafer is not conductive on its own.…”

Section: Su-8 Electroplating Moldmentioning

confidence: 99%

Fabrication of a freestanding micro mechanical structure using electroplated thick metal with a HAR SU-8 mold

Lee

2008

Microsyst Technol

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In this thesis, fabrication technology of a freestanding micro mechanical structure using electroplated thick metal with a high-aspect-ratio SU-8 mold was studied. A cost-effective fabrication process using electroplating with the SU-8 mold was developed without expensive equipment and materials such as deep reactiveion etching (DRIE) or a silicon-on-insulator (SOI) wafer. The process factors and methods for the removal of SU-8 were studied as a key technique of the thick metal micro mechanical structure. A novel method that removes crosslinked SU-8 completely without leaving remnants of the resist or altering the electroplated microstructure was utilized. The experimental data pertaining to the relationship between the geometric features and the parameters of the removal process are summarized. Based on the established SU-8 removal process, an electroplated nickel comb structure with high-aspect-ratio SU-8 mold was fabricated in a cost-effective manner. In addition, a freestanding micro mechanical structure without a sacrificial layer was successfully realized. The in-plane free movements of the released freestanding structure are demonstrated by electromagnetic actuation. This research implies that various types of MEMS devices can be developed at a low-cost with design flexibility.

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A quantitative study on the adhesion property of cured SU-8 on various metallic surfaces

Cited by 51 publications

References 20 publications

Effect of surface treatments/coatings and soft bake profile on surface uniformity and adhesion of SU-8 on a glass substrate

Effect of surface treatments/coatings and soft bake profile on surface uniformity and adhesion of SU-8 on a glass substrate

SU‐8 as a structural material for labs‐on‐chips and microelectromechanical systems

Fabrication of a freestanding micro mechanical structure using electroplated thick metal with a HAR SU-8 mold

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