A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

Xu, Huining; Liu, Changqing; Silberschmidt, Vadim V.; Pramana, Stevin S.; White, Timothy John; Chen, Zhong

doi:10.1016/j.scriptamat.2009.03.034

Cited by 97 publications

(58 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Our latest study (Xu et al, 2009) showed that ultrasonic vibration partially fragmented the native oxide layer on the surface of the aluminium pad, and intermetallic compounds were formed in the area where the oxide layer was disintegrated. Thus, it is believed that micro-joints only exist in the microslip area -not in the stationary one.…”

Section: Bonding Model For Ultrasonic Energymentioning

confidence: 99%

“…Winchell and Berg (1978) and Xu et al (2009) highlighted that ultrasonic (US) vibration disrupted the contamination and oxide layer on the surface of the ball and the bond pad during wire bonding. In addition, Langenecker (1966) found that ultrasonic energy density required to produce deformation in aluminium was about 10 7 times less than that was required for the same deformation resulted from the thermal energy alone, therefore he pointed out that an ultrasonic energy could activate dislocations, and then soften and heat materials.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Liu

Silberschmidt

et al. 2010

Journal of Materials Processing Technology

View full text Add to dashboard Cite

Section: Bonding Model For Ultrasonic Energymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Liu

Silberschmidt

et al. 2010

Journal of Materials Processing Technology

View full text Add to dashboard Cite

“…Based on our previous work, this very initial phase is CuAl 2 . 20 Previous studies of Au-Al bonds based on SEM and TEM observations revealed a 200-nm-to 500-nm-thick Au-Al IMC layer formed at the interface during the thermosonic bonding stage (175°C), 10,11 although the mechanism of formation of Au-Al IMCs within several milliseconds remains unclear. As for Cu-Al bonds, the above morphological analysis showed only approximately 30-nm-thick and discontinuous Cu-Al IMCs at the interface.…”

Section: Interfacial Morphology Of Cu-al Bonds In As-bonded Statementioning

confidence: 99%

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

Liu

Silberschmidt

et al. 2009

Journal of Elec Materi

View full text Add to dashboard Cite

Interface evolution caused by thermal aging under different temperatures and durations was investigated by means of scanning electron microscopy (SEM) and transmission electron microscopy (TEM). It was found that approximately 30-nm-thick and discontinuous Cu-Al intermetallic compounds (IMCs) were present in the initial bonds before aging. Cu-Al IMCs grew under thermal aging with increasing aging time. The growth kinetics of the Cu-Al IMCs was correlated to the diffusion process during aging; their combined activation energy was estimated to be 1.01 eV. Initially, Al-rich Cu-Al IMCs formed in the as-bonded state and early stage of aging treatment. Cu 9 Al 4 was identified by selected-area electron diffraction (SAD) as the only type of Cu-Al IMC present after thermal aging at 250°C for 100 h; this is attributed to the relatively short supply of aluminum to the interfacial reaction.

show abstract

“…In general, the mechanical strengthening of Al metal was usually achieved by the impurity doping of 0.5%-4% Cu [14,15]. Further studies on Al-Cu have reported that θ-Al 2 Cu is the first nucleus intermetallic compound [16]. Premkumar et al [15] added that this intermetallic becomes γ-Al 4 Cu 9 or η-AlCu as the purity of the Cu wire increases.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

Makhlouf

Bachaga

Suñol

et al. 2016

Metals

View full text Add to dashboard Cite

Mechanical alloying is a powder processing technique used to process materials farther from equilibrium state. This technique is mainly used to process difficult-to-alloy materials in which the solid solubility is limited and to process materials where nonequilibrium phases cannot be produced at room temperature through conventional processing techniques. This work deals with the microstructural properties of the Al-20 at. % Cu alloy prepared by high-energy ball milling of elemental aluminum and copper powders. The ball milling of powders was carried out in a planetary mill in order to obtain a nanostructured Al-20 at. % Cu alloy. The obtained powders were characterized using scanning electron microscopy (SEM), differential scanning calorimetry (DSC) and X-ray diffraction (XRD). The structural modifications at different stages of the ball milling are investigated with X-ray diffraction. Several microstructure parameters such as the crystallite sizes, microstrains and lattice parameters are determined.

show abstract

A re-examination of the mechanism of thermosonic copper ball bonding on aluminium metallization pads

Cited by 97 publications

References 16 publications

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

Growth of Intermetallic Compounds in Thermosonic Copper Wire Bonding on Aluminum Metallization

Synthesis and Characterization of Nanocrystalline Al-20 at. % Cu Powders Produced by Mechanical Alloying

Contact Info

Product

Resources

About