A review of developments in the electrodeposition of tin

Abstract

Highlights Types of aqueous electrolytes for pure tin deposits are reviewed. The many existing and developing applications of tin deposits are summarised. Emphasis is placed on versatile methanesulfonic acid electrolytes. The effects of bath composition (including additives) and operating conditions on deposit morphology are illustrated. Electrochemical studies at static and controlled flow rotating electrodes are illustrated. AbstractThe importance of tin and its electrodeposition are summarised and the scope for plating tin is outlined.Established applications of electroplated tin include corrosion protection, electronics fabrication and cooking utensils. The past 20 years have seen developments in the science and technology of tin plating, including research into nanostructured deposits, adoption of environmentally friendly methanesulfonic acid baths and more ambitious coatings including multi-layers and composites. Our ability to tailor deposit structure and composition has been improved by newer electrolytes, pulse plating and electrolyte additives. The diversity of tin applications has extended to lithium batteries using newer structures (such as composites, multi-layers and nanostructures), electrical control (e.g., pulsed current) and relative bath/electrode movement (including the use of rotating electrodes). Electrochemical aspects of modern tin deposition are illustrated by data from the authors' laboratory which highlights the versatility of methanesulfonic acid electrolytes. A wide range of deposit morphology, colour and surface finish are possible by the use of suitable addition agents and control of electrode/electrolyte movement and operating conditions. Subject areas needing further research work are identified.

A review of developments in the electrodeposition of tin-copper alloys

“…Peak B is due to the reduction of Sn 2+ to Sn, Peak C represents the oxidation of Sn to Sn 2+ , i.e., the reverse of reaction (2) and Peak D is due to the oxidation of Cu to Cu 2+ , i.e., the reverse of reaction (1) Figure 7a) shows the linear sweep voltammetry of tin, copper and tin-copper alloy deposition.…”

Composite, multilayer and three-dimensional substrate supported tin-based electrodeposits from methanesulphonic acid

“…Recent reviews have considered single metal tin 1 and tin-copper alloy electroplating 2 . This paper considers speciality tin deposits from a methanesulfonic acid bath, deposition of other single metals and Sn-Cu alloys which have been studied recently in our laboratory.…”

“…The deposition of tin and its alloys has traditionally been important as corrosion protective coatings, particularly for foodstuffs and in the electronics industry 1,2 . More recently, electrochemically produced nanostructured, multilayer and composite films have become important in rapidly-developing applications such as wear and corrosion resistant surfaces 5 or in speciality batteries and electrocatalysts 6,7 .…”

Recovery and Purification of Tin from Tailings from the Penouta Sn–Ta–Nb Deposit

“…Tin is normally deposited from divalent stannous ions, Sn 2+ , in an acidic (H 2 SO 4 ) bath [34]. At the raw, non-refined tin anode, the following oxidation reaction occurs (8):…”